Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJ3GEYJ472V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJ3GEYJ472V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJ3GEYJ472V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 4.7kΩ
- Electronic Component
- 1
- Electronic Component
- BM0003929268
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：ERJ3GEYJ472V 贴片电阻
一、产品基本信息
产品名称：ERJ3GEYJ472V
品牌：PANASONIC（松下）
封装类型：0603
功率等级：100mW
电阻值：4.7kΩ
公差：±5%
类型：厚膜电阻
二、产品特点
ERJ3GEYJ472V是一款由松下公司生产的高质量厚膜贴片电阻，采用0603封装，其小型化设计适用于各种电子设备。作为一种标准的电阻器，该产品结合了稳定的电学性能和可靠性，充分满足现代电子产品对空间和功率的严格要求。
小型化设计：0603封装的贴片电阻体积小，适合在空间受限的电路板中使用，有助于电子产品的小型化和轻量化。
功率消耗：100mW的功率耗散能力，使其适用于多种低功耗应用，能够有效地处理电场中的能量，同时确保在正常工作条件下不会过热。
电阻值与公差：其电阻值4.7kΩ以及±5%的公差容忍度，确保了在大多数应用场景中都能够提供稳定和可靠的性能。电阻的标准值使其可以广泛应用于各种电路设计中。
卓越的可靠性：厚膜技术所制造的电阻器有着优良的热稳定性和环境应力表现，适合在各种温度和湿度环境下使用。松下的制造工艺确保了产品的长期稳定性，减少了故障率。
三、应用领域
ERJ3GEYJ472V适用于多种电子产品，尤其在以下几个领域表现突出：
消费电子：如智能手机、平板、便携式设备中，可以用于信号调节、分压等电路。
工业设备：在PLC（可编程逻辑控制器）、传感器和信号处理单元等设备中，作为电压分配和反馈环路的组成部分。
汽车电子：在汽车电子系统中，包括导航、娱乐和安全系统等，对电阻性能有高要求的地方都可使用。
医疗设备：在医疗电子设备中，需要严格遵循高标准和可靠性的电子元件，ERJ3GEYJ472V能够满足此类应用的需求。
四、技术规格
| 特性 | 规格 |
|---|---|
| 功率等级 | 100mW |
| 电阻值 | 4.7kΩ |
| 公差 | ±5% |
| 封装类型 | 0603 |
| 额定电压 | 50V |
| 温度系数 | ±100ppm/℃ |
| 工作温度范围 | -55℃ 至 +155℃ |
五、总结
ERJ3GEYJ472V贴片电阻是松下公司为满足现代电子产品需求而设计的一款高性能元件。其小型化、功耗低、可靠性高等特点，及广泛的应用领域，使其成为电子工程师和产品设计师的理想选择。无论是在消费电子、工业控制还是医疗设备等领域，ERJ3GEYJ472V都表现出了出色的性能和适用性。
在选择电阻元件时，ERJ3GEYJ472V凭借其优异的品质与合理的价格，成为了众多应用中的首选。考虑到其卓越的技术指标和可靠性能，用户可以在设计电路时将其作为重要的选择。在不断发展的电子行业中，ERJ3GEYJ472V将继续为客户提供优质的电阻解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
