WMSIC Electronic Components

ERJP06F47R0V

ModelERJP06F47R0V
Package0805
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJP06F47R0V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
500mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJP06F47R0V
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.031g
Electronic Component
47Ω
Electronic Component
1
Electronic Component
BM0264911719
Operating Temperature
55℃~+155℃
Operating Voltage
400V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

松下ERJP06F47R0V厚膜贴片电阻产品概述

一、产品核心身份与定位

松下ERJP06F47R0V是一款基于厚膜工艺的通用型贴片电阻,型号命名遵循松下电阻系列的典型规则(ERJ为厚膜贴片电阻前缀,P06对应0805封装,F表示精度±1%,47R0指标称阻值47Ω,V为环保无铅版本标识)。该电阻定位为中功率、常规精度、宽温适配的工业级元件,兼顾性能稳定性与成本效益,广泛适用于消费电子、工业控制、通信设备等多领域电路设计。

二、关键技术参数详解

该电阻的核心参数明确了性能边界,需结合实际应用综合判断:

  • 阻值与精度:标称阻值47Ω,精度±1%,满足大多数电路对阻值公差的需求(如信号调理、反馈网络等场景无需更高精度)。
  • 额定功率:500mW(0.5W),指25℃环境下长期稳定工作的最大功率。需注意:实际使用需结合温度降额(如125℃时功率需降至约250mW),避免超功率发热失效。
  • 工作电压:额定电压400V,但需结合功率验证实际可用电压(公式:( V_{max} = \sqrt{P \times R} )),即实际最大允许电压约4.85V(因( 0.5W \times 47Ω = 23.5V² )),需优先遵循功率限制而非单一电压参数。
  • 温度系数(TCR):±100ppm/℃,表示温度每变化1℃,阻值变化百万分之一百。以47Ω为例,温度每升高10℃,阻值约增加47mΩ,满足常规温度环境下的稳定性需求。
  • 工作温度范围:-55℃至+155℃,覆盖工业级宽温要求,可适应极端高低温场景(如户外设备、汽车辅助电路)。

三、封装与物理特性

该电阻采用0805标准贴片封装,适配自动化生产与高密度PCB设计:

  • 尺寸规格:英寸表示为0.08×0.05英寸(长×宽),公制尺寸约2.03mm×1.27mm,厚度约0.5mm(具体以松下官方 datasheet 为准),兼容常规贴片机。
  • 工艺特点:厚膜工艺(丝网印刷电阻浆料于氧化铝陶瓷基板,高温烧结而成),具有成本低、抗硫化性能好、耐脉冲能力强等优势,区别于薄膜电阻的高精度但高成本特性。
  • 封装材质:陶瓷基板+金属电极+环氧树脂涂层,确保机械强度与电气绝缘性,支持无铅焊接(符合RoHS环保标准)。

四、典型应用场景

结合参数特性,该电阻适用于以下场景:

  1. 工业控制电路:宽温范围适配PLC、变频器等工业设备,用于信号分压、电流采样等环节。
  2. 电源电路:中功率500mW满足LDO反馈电阻、开关电源限流电阻需求,确保电源输出稳定。
  3. 通信设备:0805小封装适配基站、路由器等高密度PCB,用于射频信号调理、接口阻抗匹配。
  4. 消费电子:智能家居(温控器、智能插座)、音频设备(耳机放大器)的信号调理电路,±1%精度满足常规信号传输。
  5. 汽车电子辅助电路:若符合AEC-Q200汽车级标准(需确认松下认证),可用于车载仪表盘、车身控制模块。

五、可靠性与品质保障

松下品控确保该电阻的长期可靠性:

  • 一致性:厚膜工艺成熟,批量阻值偏差控制在±1%以内,避免同一批次性能差异。
  • 环境耐受性:抗硫化、抗潮湿性能良好,适合工业现场粉尘、湿度环境;环氧树脂涂层防机械损伤与短路。
  • 降额支持:提供完整降额曲线(如高温下功率按温度系数降低),指导用户合理使用。
  • 环保合规:无铅封装,符合RoHS 2.0、REACH标准,适配全球市场。

六、总结

松下ERJP06F47R0V以中功率、常规精度、宽温适配为核心优势,兼顾成本与性能,是工业控制、消费电子等领域的可靠选择。其0805小封装、厚膜工艺特性,既满足自动化生产需求,又确保长期稳定性,适合批量应用场景的元件选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.