Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJPA3F1501V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJPA3F1501V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJPA3F1501V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.038g
- Electronic Component
- 1.5kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264911711
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
松下ERJPA3F1501V耐电涌贴片厚膜电阻器产品概述
一、产品核心定位
ERJPA3F1501V是松下针对中小功率电路脉冲冲击场景研发的耐电涌型厚膜贴片电阻，兼顾精准度、宽温适应性与小型化设计，适配0603封装，可满足消费电子、工业控制、汽车电子等领域对设备可靠性与紧凑性的双重需求。
二、关键参数与性能指标
该电阻的核心参数围绕“耐电涌+精准稳定”展开，具体如下：
- 阻值与精度：标称阻值1.5kΩ（代码1501），精度±1%，无需额外校准即可满足模拟电路、信号调理的阻值准确性要求；
- 功率与电压：额定功率250mW，最大工作电压200V，连续负载下稳定承载，短时间脉冲冲击仍能保持性能；
- 温度特性：温度系数±100ppm/℃，在-55℃至+155℃宽温范围内，阻值漂移控制在行业优良水平；
- 封装规格：0603（英制1608）贴片封装，体积小巧（长1.6mm×宽0.8mm），适配高密度PCB布局，助力设备小型化。
三、耐电涌设计优势
作为耐电涌专项电阻，ERJPA3F1501V采用松下优化的厚膜结构：
通过调整电阻膜层的材料配比与沉积工艺，提升了对瞬态电涌（如电源开关脉冲、静电放电、电磁干扰）的耐受能力，可有效减少脉冲冲击后的阻值漂移，降低电路故障风险，延长设备使用寿命。
四、环境适应性与可靠性
- 宽温稳定工作：覆盖-55℃至+155℃温度范围，符合工业级与汽车级部分应用的环境要求，可在极端高低温交替场景下稳定运行；
- 长期可靠性：厚膜电阻本身抗老化性能优异，结合耐电涌设计，连续负载与脉冲冲击下阻值变化率控制在<0.5%（长期使用）；
- 焊接兼容性：0603封装适配回流焊、波峰焊等常规贴片制程，焊接可靠性高，适合批量生产。
五、典型应用领域
ERJPA3F1501V的性能特点使其适用于多种场景：
- 消费电子：智能手机、平板、智能穿戴的电源滤波、信号分压电路（应对充电/放电瞬态电涌）；
- 工业控制：传感器接口、PLC模块的信号调理单元（耐受工业现场电磁干扰与脉冲冲击）；
- 汽车电子：车载仪表盘背光、传感器信号处理电路（适配汽车级温度与振动环境）；
- 通信设备：路由器、交换机的电源支路电阻（应对设备启动/关闭瞬态脉冲）。
六、选型与使用注意事项
- 负载匹配：连续负载功率不超过250mW，脉冲负载需参考松下官方耐电涌曲线，避免过应力；
- 焊接工艺：遵循0603封装标准回流焊温度曲线（峰值温度<245℃），避免膜层损伤；
- 存储条件：未焊接产品存储于常温干燥环境（25℃±5℃、湿度<60%RH），防止受潮影响焊接性能。
该产品凭借耐电涌、精准稳定与小型化优势，成为中小功率电路脉冲场景的可靠选型，广泛应用于各类对可靠性要求较高的电子设备中。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
