WMSIC Electronic Components

ERA3AEB6651V

ModelERA3AEB6651V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA3AEB6651V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA3AEB6651V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.03g
Electronic Component
6.65kΩ
Electronic Component
1
Electronic Component
BM0264567876
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERA3AEB6651V 贴片薄膜电阻产品概述

一、产品基本信息

ERA3AEB6651V是松下(PANASONIC)推出的高精密贴片薄膜电阻,型号命名遵循行业通用规则:

  • 前缀“ERA”代表松下薄膜电阻系列,区别于金属膜、碳膜等类型;
  • 中间“3A”关联功率等级(100mW)与封装特性(0603);
  • “EB”标识阻值精度(±0.1%)与温度系数(±25ppm/℃);
  • 阻值编码“6651”对应实际阻值:前三位“665”为核心数值,后一位“1”代表×10¹,即665×10¹=6650Ω=6.65kΩ;
  • 后缀“V”通常关联环保工艺(无铅无镉)。

该电阻采用0603封装(英制尺寸,对应公制1608:长1.6mm×宽0.8mm),属于小体积高密度贴装元件,适配各类紧凑型电路设计。

二、核心电气参数

ERA3AEB6651V的核心参数精准匹配高精密电路需求:

  • 阻值:6.65kΩ(E96系列精密阻值,每十倍频含96个标准阻值,满足分压、反馈等高精度场景);
  • 精度:±0.1%(远超常规贴片电阻±1%/±0.5%的精度等级,可保证电路信号的一致性);
  • 额定功率:100mW(0.1W),适用于小信号电路(如模拟前端、传感器放大等低功耗场景);
  • 工作电压:75V(最大允许电压,高于常规0603封装电阻50V上限,覆盖更高电压等级的信号处理)。

三、关键性能指标

该电阻的性能稳定性是核心优势:

  • 温度系数(TCR):±25ppm/℃(低温度系数)。例如,环境温度从25℃变到125℃(温差100℃),阻值变化仅16.6Ω,相对变化率0.25%,可减少温变对电路的影响;
  • 工作温度范围:-55℃~+155℃(工业级宽温),适配汽车发动机舱、工业控制柜等极端环境;
  • 封装可靠性:陶瓷基片+薄膜电阻层+环氧树脂涂层结构,抗机械应力、抗潮湿、抗硫化性能优异,长期阻值漂移极小。

四、典型应用场景

基于高精密、宽温、小体积特性,该电阻广泛用于:

  1. 工业控制:PLC模拟量输入模块、伺服驱动器电流反馈回路(需高精度分压实现精准控制);
  2. 汽车电子:ADAS雷达信号处理、车载摄像头白平衡调节(宽温适配汽车高低温环境);
  3. 通信设备:5G基站射频前端滤波、光纤收发器信号衰减(小体积适配高密度PCB);
  4. 医疗仪器:血糖分析仪、心电图机精密测量(低漂移保证检测精度稳定)。

五、松下品牌技术优势

松下薄膜电阻具备行业领先的技术优势:

  • 成熟薄膜工艺:真空溅射薄膜技术使电阻层均匀性高,阻值与温度系数一致性优于行业平均;
  • 严格可靠性测试:通过AEC-Q200(汽车电子)、IEC 61000(电磁兼容)等国际标准测试,可应对振动、湿热等恶劣工况;
  • 环保合规:符合RoHS 2.0、REACH指令,无铅无镉,适配绿色制造需求。

ERA3AEB6651V凭借高精密、宽温稳定、小体积等特点,成为各类高要求电路设计的理想选择,可有效提升电路性能的一致性与长期可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.