WMSIC Electronic Components

ERJ6ENF2001V

ModelERJ6ENF2001V
Package0805
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ6ENF2001V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ6ENF2001V
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.031g
Electronic Component
2kΩ
Electronic Component
1
Electronic Component
BM0264570351
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ6ENF2001V 厚膜贴片电阻产品概述

ERJ6ENF2001V是松下(PANASONIC)旗下ERJ系列中的一款通用型厚膜贴片电阻,采用0805封装,核心参数覆盖阻值、精度、功率等基础需求,广泛适配工业控制、消费电子、通信设备等多领域电路设计,兼具成本优势与性能稳定性。

一、产品核心身份与定位

该电阻属于厚膜贴片电阻,通过丝网印刷电阻浆料并烧结的工艺制造,相比薄膜电阻成本更低,相比线绕电阻体积更小,是中低端精度需求场景的主流选择。型号中“ERJ6E”对应系列与封装特性,“NF”代表精度与温度系数等级,“2001”为阻值编码(前三位200,后一位1表示×10¹,即2kΩ),“V”为环保标识(符合RoHS标准)。其定位为常规高精度通用电阻,满足大多数电路对阻抗匹配、分压、限流的基础需求,无需额外特殊工艺适配。

二、关键电气参数解析

1. 阻值与精度

  • 标称阻值:2kΩ(2000Ω),编码规则清晰(4位数字:前三位为有效数字,第四位为倍率);
  • 精度等级:±1%,属于厚膜电阻的常规高精度等级,可满足传感器信号调理、电源分压等对阻值偏差要求不苛刻但需稳定的场景(如避免因阻值偏差导致基准电压偏移)。

2. 功率与电压额定值

  • 额定功率:125mW(0.125W),为0805封装厚膜电阻的标准功率等级,实际使用中需确保电阻功耗不超过此值(计算方式:(P=I^2R=V^2/R),需结合电路实际电压/电流);
  • 最大工作电压:150V,需注意功率与电压的联动限制(如2kΩ电阻在150V下的功耗为(150^2/2000=11.25W),远超过125mW,因此实际工作电压需根据功率反推,最大允许电压为(\sqrt{P×R}=\sqrt{0.125×2000}≈15.8V),设计时需双重校验)。

3. 温度系数(TCR)

  • 温度系数:±100ppm/℃,表示环境温度每变化1℃,阻值变化百万分之一百。例如,当温度从25℃升至125℃(温差100℃),阻值变化为±1%,与精度等级匹配,可覆盖一般工业环境的温度波动需求(如车间温度变化±20℃,阻值变化±0.2%,不影响常规电路性能)。

三、物理封装与工艺特性

  • 封装类型:0805(英制尺寸:0.08英寸×0.05英寸,对应公制2012:2.0mm×1.2mm),适配主流SMT(表面贴装技术)生产线,支持自动化焊接,适合高密度PCB布局(如手机主板、小型工业模块);
  • 工艺特点:厚膜工艺通过在陶瓷基板上印刷电阻浆料、烧结形成电阻层,再覆盖保护涂层,具有阻值一致性好、抗机械应力强、防潮性佳等优势;相比薄膜电阻,厚膜工艺的成本更低,适合批量应用。

四、典型应用场景

ERJ6ENF2001V的参数特性使其适配多领域电路:

  1. 消费电子:手机、平板的电源电路分压、信号滤波,耳机接口阻抗匹配;
  2. 工业控制:PLC(可编程逻辑控制器)的输入输出模块阻抗匹配、传感器信号调理电路(如温度传感器的分压基准);
  3. 通信设备:路由器、交换机的信号衰减、电源稳压电路;
  4. 汽车电子(部分场景):车载信息娱乐系统的辅助电路(因工作温度范围宽,可覆盖车载环境的低温启动与高温运行)。

五、可靠性与环境适应性

  1. 工作温度范围:-55℃至+155℃,覆盖工业级(-40℃+85℃)与部分汽车级(-40℃+125℃)的温度要求,极端环境下仍能保持稳定性能;
  2. 长期可靠性:松下经过严格老化测试,阻值漂移率低(通常小于0.5%/1000小时),焊接可靠性符合J-STD-001标准,抗机械冲击与振动(满足IEC 60068-2-6振动测试要求);
  3. 环保合规:符合RoHS 2.0、REACH等国际环保标准,不含铅、镉等有害物质,适配全球市场需求。

六、品牌与品质背书

松下作为全球知名电子元器件制造商,ERJ系列电阻拥有超过30年的生产经验,产品一致性与稳定性经过市场验证。该电阻供货周期稳定,技术支持完善,适合批量生产与定制化需求,是众多电子厂商的主流选择之一。

综上,ERJ6ENF2001V以平衡的性能、成本与可靠性,成为通用电路设计中2kΩ±1%厚膜贴片电阻的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.