WMSIC Electronic Components

EEEFK1E101SP

ModelEEEFK1E101SP
PackageSMD,6.3x5.8mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC EEEFK1E101SP
Type
PANASONIC
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
EEEFK1E101SP
Electronic Component
1
Electronic Component
100uF
Package
SMD,6.3x5.8mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
0.314g
Electronic Component
1
Electronic Component
BM0264224042
Electronic Component
2000hrs@105℃
Operating Temperature
55℃~+105℃
Current
240mA@100kHz
Voltage
25V
Capacitor
6.3mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

松下EEEFK1E101SP贴片铝电解电容产品概述

松下EEEFK1E101SP是一款针对小型化、高可靠性电路设计的贴片铝电解电容,属于松下电解电容产品线中的常规容量电压规格,广泛适配消费电子、工业控制及车载等领域的基础滤波、耦合需求,凭借稳定的电气性能与紧凑的封装设计成为市场主流选择之一。

一、产品基本定位与核心属性

该型号为贴片式铝电解电容,型号命名中“EEEFK”为松下电解电容系列标识,“1E”对应额定电压25V,“101”表示标称容值100μF(10×10¹),“SP”为封装与精度后缀(±20%精度)。产品核心定位是中低功率电路的基础储能与滤波元件,兼顾小尺寸与实用性能,无需特殊定制即可满足多数常规应用场景。

二、关键电气性能参数详解

  1. 容值与精度:标称容值100μF,精度±20%,符合铝电解电容的标准精度等级,能够满足多数电路对滤波、耦合容量的基础需求,无需额外高精度匹配。
  2. 额定电压:25V(对应型号中“1E”代码),是消费电子与小型工业电路的常用电压规格,可在1.2倍额定电压下短时间工作(常规电解电容特性),安全余量充足。
  3. 纹波电流与ESR:240mA(@100kHz)的纹波电流能力,配合360mΩ(@100kHz)的等效串联电阻(ESR),可有效抑制高频纹波噪声,降低电路损耗——这两个参数是判断电解电容滤波性能的核心指标,该型号在小尺寸下表现均衡。

三、物理尺寸与封装规格

该型号采用SMD表面贴装封装,适配自动化贴片生产线,无需手工焊接。电容本体直径6.3mm,封装标注尺寸为D6.3×L5.8mm(含引脚的整体尺寸),属于小型化贴片电解的典型规格,可兼容多数紧凑型PCB的布局需求,尤其适合空间受限的便携式设备或高密度电路板设计。

四、工作环境与寿命特性

  1. 温度范围:工作温度覆盖-55℃至+105℃,宽温特性使其可适配低温环境(如北方户外设备)与高温环境(如密闭机箱内的电路),无需额外降额使用。
  2. 寿命表现:在105℃高温下可稳定工作2000小时,换算至常温(25℃)下寿命可达数万小时,满足长期连续工作的可靠性需求,适合对寿命有要求的工业控制或车载电路。

五、典型应用场景

基于其参数与封装特性,EEEFK1E101SP的典型应用包括:

  • 小型开关电源:如LED驱动电源、手机充电器辅助滤波电路;
  • 便携式电子设备:平板电脑、智能手表的电源管理模块;
  • 工业控制电路:PLC(可编程逻辑控制器)的信号滤波、耦合环节;
  • 车载电子:车载音响、仪表盘的辅助电源电路(适配宽温需求)。

六、产品优势与市场价值

  1. 品牌可靠性:松下作为老牌电子元器件厂商,该型号采用成熟的电解电容制造工艺,低故障率、一致性好;
  2. 成本效益:常规容量电压规格,无特殊定制成本,性价比高;
  3. 兼容性强:小尺寸贴片封装适配多数PCB设计,宽温与长寿命覆盖广场景;
  4. 性能均衡:纹波电流与ESR参数匹配中低功率电路需求,无需额外升级更高规格元件。

该型号作为松下电解电容产品线的基础款,凭借稳定的性能、紧凑的封装与高可靠性,成为电子工程师在常规电路设计中的常用选择,可有效降低设计复杂度与成本。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.