Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJ2RKF3002X
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJ2RKF3002X
- Type
- PANASONIC
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJ2RKF3002X
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.011g
- Electronic Component
- 30kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257247263
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ2RKF3002X 产品概述
一、基本信息
ERJ2RKF3002X是一款由松下（Panasonic）生产的高性能厚膜贴片电阻器，其具有广泛的应用范围和优异的电气特性。这款电阻器的主要参数如下：
- 功率: 100mW
- 阻值: 30kΩ
- 精度: ±1%
- 工作温度范围: -55℃到+155℃
- 温度系数: ±100ppm/℃
- 商品分类: 贴片电阻
- 电阻类型: 厚膜电阻
- 封装尺寸: 0402
二、产品特性
高精度和稳定性: ERJ2RKF3002X采用厚膜电阻技术，具有优越的温度稳定性和长期可靠性，以及相对较低的温度系数（±100ppm/℃）。这样的特性使得该电阻非常适合在高精度和稳定性要求的应用场合使用，能有效抵御环境变化对电阻值的影响。
宽广的工作温度范围: 该电阻器能够在-55℃到+155℃的温度范围内正常工作，使其适用于极端环境条件下的应用，如汽车、工业自动化和航空航天等。
小尺寸封装: ERJ2RKF3002X采用0402封装（即1005英制尺寸），使其适合于高密度电路板设计。小尺寸有助于节省空间，适合轻薄化电子产品的设计需求。
高功率处理能力: 这款贴片电阻的额定功率为100mW，适用于一般的低功率应用场景，确保了其在正常工作条件下能保持良好的性能和稳定性。
三、应用领域
ERJ2RKF3002X适用于多种电子电路应用，包括但不限于以下领域：
消费电子: 例如智能手机、平板电脑、可穿戴设备等，因其小尺寸和高稳定性，适合用于信号处理和电源管理电路中。
汽车电子: 由于其宽温工作范围和可靠性，适合用于汽车内部的控制单元、传感器和其他关键电子部件。
工业设备: 可用于传感器模块、控制系统和其他需要高耐久性和精度的工业设备中，以确保长期稳定的运行性能。
通信设备: 适用于各种通信产品中，如网络设备、基站及射频应用，能有效保证信号的稳定性。
医疗设备: 由于对温度和湿度的极高要求，该电阻非常适合用于医疗监测和准确测量设备中，确保测量结果的可靠性。
四、总结
ERJ2RKF3002X作为松下推出的一款高性能厚膜贴片电阻，凭借其优越的温度特性、可适应多种应用环境的能力，以及小巧的0402封装设计，为现代电子产品提供了可靠的解决方案。无论是在消费电子、汽车、工业或通信等领域，ERJ2RKF3002X都能够满足高标准的设计需求，是电子工程师的理想选择。在未来的应用中，它将继续发挥重要作用，推动电子科技的发展。
对于希望在设计中寻求高精度、高可靠性和小型化的工程师来说，选择ERJ2RKF3002X将是一个明智的决策。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
