WMSIC Electronic Components

ERA3AEB113V

ModelERA3AEB113V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA3AEB113V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA3AEB113V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.026g
Electronic Component
11kΩ
Electronic Component
1
Electronic Component
BM0264567885
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PANASONIC ERA3AEB113V 高可靠性薄膜贴片电阻器产品概述

一、产品核心身份与定位

ERA3AEB113V是PANASONIC(松下)推出的一款高可靠性薄膜贴片电阻器,属于其薄膜电阻系列中的高精度型号。型号编码中:“113”代表阻值为11kΩ(11×10³Ω),“B”标识精度等级为±0.1%,“0603”封装对应小体积贴片设计,核心定位为满足对阻值精度、温度稳定性、长期可靠性要求较高的电子电路,尤其适合工业控制、精密测量、通信等领域的高密度集成场景。

二、关键电气性能参数

该电阻的核心电气指标经过优化,平衡了精度与实际应用的可靠性:

  • 阻值与精度:11kΩ±0.1%——高于普通贴片电阻(通常1%~5%精度),可有效降低电路中的信号失真、分压误差,适合精密信号调理、基准电压生成等场景;
  • 功率与电压:额定功率100mW,最大工作电压75V——实际使用需遵循“功率≤100mW、电压≤75V”的双重限制(例如:施加75V电压时,通过电流约6.8mA,功率约0.51W,需严格控制功耗在额定值内);
  • 温度系数(TCR):±25ppm/℃——温度每变化1℃,阻值变化约0.0025%;若工作温度变化100℃(如-55℃到+45℃),阻值偏差仅0.25%,远优于普通电阻的±100ppm/℃以上水平,确保宽温环境下性能稳定;
  • 工作温度范围:-55℃~+155℃——覆盖工业级宽温要求,可适应高温作业设备、低温户外场景等极端环境。

三、封装与物理特性

采用0603封装(英制:0.06英寸×0.03英寸;公制:1.6mm×0.8mm),属于小型贴片封装:

  • 体积紧凑,适合高密度PCB设计(如智能手机、基站模块等小尺寸设备);
  • 端电极采用松下成熟的镀锡/镀金工艺,焊接兼容性强,可通过回流焊、波峰焊实现自动化贴装,良率高;
  • 薄膜电阻层采用真空溅射+激光微调工艺,保证阻值一致性,批量生产中参数离散性小。

四、可靠性与环境适应性

作为“高可靠性”产品,ERA3AEB113V在可靠性设计上具备以下特点:

  • 长期稳定性:薄膜电阻的低漂移特性(长期阻值变化通常≤0.1%/1000小时),适合需要长期稳定运行的设备(如工业PLC、医疗监护仪);
  • 抗恶劣环境:宽温范围、耐湿度(符合IEC 60068等环境测试标准),可应对工业现场的粉尘、湿度变化等工况;
  • 无铅环保:符合RoHS 2.0、REACH等环保法规,端电极不含铅,满足绿色制造要求。

五、典型应用场景

结合参数与可靠性,该电阻适用于以下场景:

  1. 精密测量仪器:示波器、数字万用表、频谱分析仪的分压/限流电阻,利用高精度保证测量准确性;
  2. 工业控制模块:PLC、伺服驱动器的信号调理电路,宽温与高可靠性适应工业现场的温度波动;
  3. 通信设备:基站射频前端的小信号电路、光纤收发器的偏置电阻,小体积满足高密度集成;
  4. 汽车电子:车载传感器(如胎压监测、温度传感器)的信号处理电路(潜在适配汽车电子中对精度要求高的子系统);
  5. 医疗设备:监护仪、输液泵的信号放大电路,高可靠性保证医疗设备的稳定运行。

六、品牌与工艺优势

PANASONIC作为全球知名电子元器件厂商,其薄膜电阻具备以下优势:

  • 工艺成熟:真空溅射薄膜层保证低噪声、高线性度,激光微调实现±0.1%精度的批量一致性;
  • 质量管控严格:每批次经过全参数测试,不良率低;
  • 技术支持完善:提供完整的datasheet与应用指导,帮助工程师快速选型与应用。

该产品凭借高精度、宽温稳定性与高可靠性,成为工业、通信、医疗等领域高密度电路设计的优选元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.