WMSIC Electronic Components

ERJPA3J2R2V

ModelERJPA3J2R2V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJPA3J2R2V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
333mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJPA3J2R2V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
2.2Ω
Electronic Component
1
Electronic Component
BM0264911710
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

松下ERJPA3J2R2V耐电涌厚膜贴片电阻器产品概述

一、基础参数详解

松下ERJPA3J2R2V属于耐电涌厚膜贴片电阻系列,核心参数精准匹配工业级应用的可靠性需求,关键参数如下:

  • 电阻类型:厚膜电阻,采用丝网印刷+高温烧结工艺制造,兼具批量生产的成本优势与稳定的电气性能;
  • 阻值与精度:标称阻值2.2Ω,精度±5%,满足大多数非高精度电流检测、分压、限流场景的误差要求;
  • 功率与电压:额定功率333mW(0.333W),最大工作电压150V,实际使用需遵循降额原则(如环境温度超过100℃时需降低功率使用);
  • 温度特性:温度系数±200ppm/℃,即温度每变化1℃,阻值变化±4.4μΩ,在宽温范围内保持性能稳定;
  • 工作温度范围:-55℃至+155℃,覆盖工业级、汽车级环境的极端温度要求,无需额外设计温度补偿电路。

二、核心特性与设计亮点

作为松下耐电涌贴片电阻的代表型号,ERJPA3J2R2V的核心优势集中在抗瞬态冲击与宽温可靠性:

  1. 强耐电涌性能:针对雷击、开关浪涌等瞬态电压/电流冲击,优化了厚膜材料配方与端电极结构,比普通厚膜电阻的抗冲击能力提升约30%(参考松下同类产品对比数据),可有效减少阻值漂移或开路风险;
  2. 小型化贴片设计:采用紧凑贴片封装(具体尺寸需参考松下官方 datasheet),适合高密度PCB布局,满足小型化电子设备的设计需求;
  3. 宽温稳定性:温度系数与工作温度范围的组合,使其在极端环境下仍能保持电气参数一致性,避免因温度变化导致电路功能偏移;
  4. 品牌可靠性:松下成熟的生产工艺确保每只电阻的参数一致性,批量应用良率达99.5%以上,适合对可靠性要求较高的领域。

三、典型应用场景

ERJPA3J2R2V的参数特性使其适用于以下场景:

  1. 电源电路:开关电源的输出滤波电阻、电池管理系统(BMS)的小电流检测电阻(适合≤0.4A电流范围);
  2. 汽车电子:车载仪表盘背光限流、传感器接口分压电阻,宽温范围适配汽车舱内/舱外的温度变化;
  3. 工业控制:PLC输入/输出接口电阻、传感器信号调理电路限流元件,耐电涌特性可抵抗工业现场电磁干扰;
  4. 消费电子:音频设备信号分压、LCD显示驱动电流限制电阻,兼顾成本与可靠性;
  5. 通信设备:基站射频前端信号调理、电源模块浪涌抑制,耐电涌能力应对通信网络瞬态电压冲击。

四、性能优势与市场定位

与同类竞品相比,ERJPA3J2R2V的核心竞争力在于**“耐电涌+宽温+成本平衡”**:

  • 对比普通厚膜电阻:抗电涌能力更强,无需额外增加浪涌保护元件,简化电路设计;
  • 对比功率电阻:体积更小(贴片封装),适合小型化设计,且成本仅为功率电阻的60%左右;
  • 对比高精度电阻:精度±5%满足大多数应用,成本仅为高精度电阻的1/3~1/2,性价比突出。

其市场定位覆盖工业控制、汽车电子、消费电子、通信设备等中低端至中端领域,是追求可靠性、耐电涌与成本平衡的理想选择。

该型号凭借松下的工艺优势与参数适配性,已成为多个行业批量应用的主流耐电涌贴片电阻之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.