WMSIC Electronic Components

ERA6AEB132V

ModelERA6AEB132V
Package0805
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA6AEB132V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA6AEB132V
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.031g
Electronic Component
1.3kΩ
Electronic Component
1
Electronic Component
BM0264920482
Operating Temperature
55℃~+155℃
Operating Voltage
100V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PANASONIC ERA6AEB132V 片式薄膜电阻产品概述

一、产品核心身份与定位

ERA6AEB132V是PANASONIC(松下)推出的0805封装高可靠性金属膜(薄膜)片式电阻,核心规格为1.3kΩ±0.1%、125mW,属于精密小功率电阻范畴。其设计聚焦「高精度、宽温稳定、小尺寸」三大核心,适配对阻值一致性、环境适应性要求较高的电子电路场景,是工业控制、汽车电子、精密仪器等领域的常用选型。

二、关键技术参数深度解析

该电阻的技术参数直接决定应用边界,核心参数及实际意义如下:

  • 阻值与精度:1.3kΩ(对应电阻编码「132」,即13×10²Ω),精度±0.1%——批量生产中阻值一致性优异,无需额外校准即可满足精密电路的信号精准度(如仪器仪表的基准电压电路)。
  • 功率额定值:125mW——适用于低功耗电路,实际使用建议降额至80%(100mW),可显著延长寿命并降低热漂移。
  • 工作电压:100V(额定值)——正常工作电压不得超过此值,避免绝缘层击穿或阻值漂移。
  • 温度系数(TCR):±25ppm/℃——温度变化对阻值影响极小:若环境温度从25℃升至125℃(变化100℃),阻值仅变化±2.5Ω,稳定适配宽温场景。
  • 工作温度范围:-55℃~+155℃——覆盖工业级宽温需求,可在极端环境(如汽车发动机舱、户外工业传感器)中稳定工作。

三、封装与尺寸规格

采用0805英寸封装(公制对应2012,即2.0mm×1.2mm),为表面贴装(SMD)结构:

  • 尺寸紧凑:长2.0±0.2mm、宽1.2±0.2mm、厚0.5±0.1mm(典型值),有效节省PCB布局空间,适配高密度电路设计。
  • 贴装兼容性:支持回流焊、波峰焊工艺,符合电子制造自动化生产线要求,可与其他0805封装元器件协同布局。

四、典型应用场景

结合参数特性,ERA6AEB132V的核心应用场景包括:

  1. 工业控制电路:PLC模拟量输入模块的信号调理(分压、滤波),±0.1%精度保证采集准确性,-55~155℃宽温适配车间极端温差。
  2. 汽车电子辅助系统:车载传感器(温度、压力传感器)接口电路,宽温范围满足发动机舱、车载电子的环境要求。
  3. 精密仪器仪表:万用表、示波器的校准基准电路,±0.1%精度确保测量误差可控。
  4. 高端消费电子:音频解码芯片偏置电路、智能手机射频前端匹配网络,小尺寸适配高密度PCB。
  5. 通信设备:基站射频模块辅助偏置电路,低功耗、小尺寸满足通信设备紧凑化需求。

五、可靠性与品质保障

作为松下品牌的高可靠性电阻,ERA6AEB132V具备以下优势:

  • 薄膜电阻特性:金属膜比碳膜噪声更低、稳定性更强,长期使用后阻值漂移极小。
  • 抗老化性能:经松下严苛测试(高温高湿、温度循环),可保证1000小时以上稳定工作寿命。
  • 一致性管控:批量生产中阻值、TCR等参数一致性严格,适合大规模自动化生产。

六、选型与使用注意事项

  1. 功率降额:实际功耗需≤100mW(额定值80%),避免热过载导致阻值漂移。
  2. 电压限制:工作电压不得超过100V,高压电路需串联分压电阻。
  3. 焊接工艺:遵循松下推荐回流焊曲线(峰值240~250℃,时间≤30s),避免高温损坏电阻。
  4. 存储条件:未贴装时存储在常温(15~35℃)、干燥(相对湿度≤60%)环境,避免潮湿影响引脚可焊性。

总结:ERA6AEB132V凭借「高精度、宽温稳定、小尺寸、高可靠性」的综合优势,成为多个领域精密电路的优选元件,适配从工业控制到消费电子的多样化需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.