WMSIC Electronic Components

ERA3AEB6042V

ModelERA3AEB6042V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA3AEB6042V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA3AEB6042V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.03g
Electronic Component
60.4kΩ
Electronic Component
1
Electronic Component
BM0264567927
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERA3AEB6042V 薄膜贴片电阻产品概述

一、核心身份与封装规格

ERA3AEB6042V是松下(PANASONIC) 旗下ERA系列的高精度薄膜贴片电阻,采用0603英制封装(对应公制1608规格),尺寸紧凑(长1.6mm×宽0.8mm),专为小型化电子设备设计。作为薄膜电阻类型,其通过真空镀膜工艺实现阻值的高精度控制,区别于碳膜电阻的阻值稳定性,更适配对温漂、精度要求严苛的场景。

二、关键电气性能参数

该电阻的核心参数围绕“高精度、低漂移、小体积”设计,具体如下:

  • 阻值与精度:标称阻值60.4kΩ,精度±0.1%——这一等级可满足多数模拟电路对阻值一致性的要求(如精密分压、运放反馈网络);
  • 功率与电压:额定功率100mW,最大工作电压75V——适配低至中等功耗的电路(如传感器信号调理、音频前置放大),无需额外降额即可稳定工作;
  • 温度特性:温度系数±25ppm/℃,工作温度范围-55℃~+155℃——温漂极小,在极端温度下(如工业现场、车载环境)仍能保持阻值稳定;
  • 封装适配:0603封装兼容主流SMT(表面贴装)生产线,支持自动化组装,适合批量生产需求。

三、设计特点与优势

  1. 薄膜工艺的稳定性:采用金属薄膜(如镍铬合金)真空镀膜,相比碳膜电阻,阻值漂移率降低60%以上,长期使用后阻值变化可忽略;
  2. 小体积高集成:0603封装仅为传统插件电阻的1/10体积,可大幅缩小电路PCB面积,适配智能穿戴、蓝牙耳机等小型设备;
  3. 品牌可靠性:松下严格的质量管控体系,产品符合IEC 61000-4-2(ESD抗扰度)、JIS C 5102等国际标准,耐湿、耐温冲击性能优异(如在85℃/85%RH环境下1000小时阻值变化≤0.1%)。

四、典型应用场景

该电阻的参数特性决定了其在高精度模拟电路、小型化设备、工业控制三大领域的广泛应用:

  1. 精密模拟电路:运放的反馈/分压电阻(如精密电压基准电路、数据采集模块),0.1%精度确保增益/分压比准确;
  2. 消费电子小型化:智能手表、蓝牙耳机的传感器信号调理(如心率传感器、加速度计的前置放大),0603封装适配设备轻薄化需求;
  3. 工业控制模块:PLC模拟输入通道的信号衰减电阻、温度传感器的信号校准电阻,宽温范围(-55℃~+155℃)可覆盖工业现场的极端环境;
  4. 汽车电子(非车载级):车载娱乐系统的音频电路(如导航仪的前置放大),低温度系数确保音质在不同温度下的一致性。

五、选型与使用注意事项

  1. 功率降额:若工作环境温度超过70℃,需按松下官方降额曲线调整(如125℃时降额至50mW);
  2. 焊接兼容性:支持回流焊、波峰焊工艺,焊接温度需控制在260℃以内(峰值时间≤10秒);
  3. 静电防护:薄膜电阻对ESD敏感,组装过程需采用防静电措施(如接地工作台、离子风扇)。

综上,ERA3AEB6042V以“高精度、小体积、宽温稳定”为核心优势,是小型化电子设备、工业控制及消费电子领域高精度模拟电路的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.