Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERA6AEB104V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERA6AEB104V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERA6AEB104V
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.031g
- Electronic Component
- 100kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264570327
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 100V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
松下ERA6AEB104V高可靠性薄膜贴片电阻器产品概述
松下ERA6AEB104V是一款针对高精度信号处理、稳定环境运行场景打造的薄膜贴片电阻器，依托松下成熟的薄膜电阻工艺，兼顾电气性能精度、温度稳定性与环境适应性，是工业控制、医疗设备等领域的可靠选择。
一、产品核心定位与技术类别
该电阻属于薄膜贴片电阻范畴，区别于厚膜、碳膜等类型，采用薄膜沉积工艺制备电阻层，具备更低的噪声系数、更优的温度漂移特性。产品定位为“高可靠性高精度电阻”，针对对阻值稳定性、精度要求严苛的应用场景，替代部分传统插件电阻以适配表面贴装（SMT）工艺，助力设备小型化设计。
二、关键电气性能参数详解
- 阻值与精度：标称阻值100kΩ（代码标识“104”，对应10×10⁴Ω），精度等级±0.1%——属于工业级高精度标准，可满足信号调理、校准电路等对阻值偏差要求严格的场景；
- 功率与电压限制：额定功率125mW，最大工作电压100V。需注意两者的关联：实际工作中若电压接近100V，功率消耗为V²/R=100²/1e5=100mW，未超过额定功率，可安全运行；
- 温度系数（TC）：±25ppm/℃——表示温度每变化1℃，阻值变化±25×10⁻⁶×100kΩ=±2.5Ω，温度稳定性优于普通厚膜电阻（通常±50ppm/℃以上）。
三、环境适应性与温度特性
产品工作温度范围覆盖**-55℃~+155℃**，可适配极端温度场景：
- 低温场景：如户外低温设备、极地测试仪器；
- 高温场景：如工业炉周边电路、汽车发动机舱传感器电路（需结合实际降额设计）；
温度系数±25ppm/℃意味着在全温区，阻值最大变化约±325Ω（相对变化0.325%），满足大多数工业应用的稳定性要求。
四、物理封装与工艺优势
采用贴片封装形式（常见0603/0805等小型封装，具体尺寸需参考松下官方规格书），适配自动化SMT生产线，生产效率高；薄膜电阻层的均匀性优于厚膜，抗老化性能更强——长期运行后阻值漂移小，适合24/7连续工作的工业设备。
五、典型应用场景
- 工业自动化控制系统：PLC输入输出模块的信号调理电路、传感器信号放大电路；
- 医疗设备：监护仪的生理信号采集、医用仪器的校准电阻；
- 通信设备：射频电路的匹配网络、中频信号滤波电路；
- 测试测量仪器：示波器、万用表的高精度分压/分流电路；
- 汽车电子（需确认车载可靠性标准）：发动机传感器信号处理电路。
六、可靠性与品质保障
依托松下电子的品质管控体系，产品通过多项可靠性测试（温度循环、湿度老化、振动冲击等），符合工业级可靠性要求；薄膜电阻的抗ESD（静电放电）性能优于碳膜电阻，可降低生产与使用中的静电损坏风险。
该产品以“高精度+宽温区+高可靠”为核心优势，适配多领域对稳定电阻元件的需求，是松下薄膜电阻系列中的实用型代表。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
