WMSIC Electronic Components

AYF530435

ModelAYF530435
PackageSMD, P=0.5mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
PANASONIC AYF530435
Type
PANASONIC
Unit
Electronic Component
Minimum package
5000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
AYF530435
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.116g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0257329299
Electronic Component
Electronic Component
Operating Temperature
55℃~+85℃
Electronic Component
1mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

松下AYF530435 FFC/FPC连接器产品概述

松下AYF530435是一款专为高密度、小体积电子设备设计的4Pin翻盖式下接FFC/FPC连接器,采用表面贴装(SMD)卧贴封装,适配0.3mm厚度的柔性电缆,核心聚焦柔性电路与PCB之间的可靠电连接,满足便携、车载、工业等多场景的小型化与宽温适应性需求。

一、产品定位与核心属性

作为松下FFC/FPC连接器系列的典型型号,AYF530435针对空间受限、装配高效的应用场景优化设计:

  • 核心功能:实现FFC(柔性扁平电缆)或FPC(柔性印刷电路)与PCB的稳定电信号传输;
  • 关键特征:4Pin触点配置、0.5mm引脚间距、翻盖式锁定、下接触点布局、卧贴SMD封装;
  • 适配范围:兼容厚度0.3mm的柔性电缆,支持自动化贴装与手工装配(翻盖结构操作简便)。

二、核心技术参数

AYF530435的关键参数严格匹配小型化与可靠性需求,具体如下:

参数类别 详细规格 触点数量 4Pin(4P) 引脚间距 0.5mm(中心距) 安装方式 卧贴式(表面贴装SMD) 连接方式 翻盖式锁定,下接触点 柔性电缆适配 厚度0.3mm 板上安装高度 1mm(PCB表面至顶部) 触头材质 铜合金(高导电基底) 触头镀层 镀金(抗腐蚀、低接触电阻) 工作温度范围 -55℃ ~ +85℃(宽温适应)

三、结构设计与工艺特点

AYF530435的设计围绕小型化、可靠性、装配效率三大核心:

  1. 翻盖式锁定结构:通过手动开合翻盖即可完成FFC/FPC的插入与锁定,无需螺丝、卡扣等额外固定件,装配流程简化,且锁定后触点接触稳定,不易因振动松动;
  2. 下接触点布局:FFC/FPC从连接器下方接入PCB,上方空间无遮挡,适配PCB双面布局或顶部有高度限制的设备(如超薄智能手表);
  3. 卧贴SMD封装:引脚采用表面贴装设计,支持自动化贴片机高速贴装,大幅提升批量生产效率,同时避免通孔安装的空间占用;
  4. 镀金触头工艺:铜合金基底表面镀金,有效降低接触电阻(确保信号传输损耗小),同时提升抗氧化、抗腐蚀能力,延长产品使用寿命;
  5. 超小安装高度:板上高度仅1mm,满足便携式设备“轻薄化”设计需求,可嵌入紧凑的内部空间。

四、典型应用场景

AYF530435的参数特性使其适配多领域的小型化设备:

  • 消费电子:智能手表、蓝牙耳机、便携式游戏机(如Switch Lite等小型掌机)的内部柔性电路连接;
  • 车载电子:仪表盘小型控制模块、车载摄像头的柔性排线连接(宽温范围适配车载-40℃~85℃环境);
  • 医疗设备:小型血糖仪、指尖血氧仪等便携医疗设备的内部信号传输;
  • 工业控制:小型传感器节点、微型PLC模块的柔性电路连接(宽温适应工业现场环境)。

五、产品优势与应用价值

相较于同类产品,AYF530435的核心优势在于**“小型化+可靠性+适配性”的平衡**:

  • 小型化优势:0.5mm间距+1mm板高,适配高密度PCB布局,满足设备轻薄化趋势;
  • 可靠性优势:镀金触头+翻盖锁定,抗振动、抗腐蚀,确保长期稳定传输;
  • 宽温适配:-55℃~+85℃工作范围,覆盖车载、工业等严苛环境;
  • 装配效率:卧贴SMD+翻盖结构,支持自动化生产与手工快速装配,降低制造成本。

总结:松下AYF530435是一款针对小型化电子设备优化的高性价比FFC/FPC连接器,凭借可靠的连接性能、紧凑的尺寸设计与宽温适应性,成为便携、车载、医疗等领域的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.