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ERJP06F60R4V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJP06F60R4V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJP06F60R4V
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.031g
- Electronic Component
- 60.4Ω
- Electronic Component
- 1
- Electronic Component
- BM0257247268
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 400V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJP06F60R4V 产品概述
一、主要规格
ERJP06F60R4V 为松下（PANASONIC）生产的贴片厚膜电阻，关键参数如下：阻值 60.4 Ω，精度 ±1%，额定功率 500 mW，最高工作电压 400 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55℃ 至 +155℃，封装为 0805（约 2.0 × 1.25 mm）。
二、性能要点
- 厚膜工艺：成本与可制造性良好，适合大批量常规精度场合。
- 精度 ±1%：适用于一般精密电阻网络、分压、滤波与阻尼电路。
- TCR ±100 ppm/℃：温度漂移中等，对温度敏感度要求不极端的应用可接受。
- 高工作电压 400 V：标示该型号在耐压与绝缘性能上适合高电压环境的封装限制（注意下述功率限制）。
三、电压与功率的关键提示
工作电压（400 V）指元件在不发生绝缘击穿或表面爬电的条件下可承受的最大直流电压，而不代表可在该电压下耗散额定功率。实际受限于功率 P 与阻值 R 的关系： P = V^2 / R。
对于本器件，若要保持 0.5 W 的耗散，允许的最大两端电压约为： Vmax = sqrt(P×R) ≈ sqrt(0.5×60.4) ≈ 5.5 V。
因此在高压电路中需通过串联电阻或分压结构分担电压，避免单颗元件既承受高压又超出功率能力。
四、典型应用场景
- 开关电源/高压电源中的分压、检流或偏置电阻（需串联分压或多颗并联/串联布局）。
- 滤波、RC 时间常数电路、阻尼与阻抗匹配（中等精度场合）。
- 通信设备、工业控制与消费电子中对体积与成本敏感的常规电阻需求场合。
五、封装与装配建议
0805 封装尺寸紧凑，建议使用标准 SMT 回流焊工艺（建议参照松下官方回流曲线），注意焊盘设计以降低热应力与焊接翘曲。避免在贴片周边施加机械应力（弯曲、挤压），器件焊点冷却不均或过多的热循环会影响长期可靠性。
六、可靠性与降额
工作温度范围宽（-55℃ 至 +155℃），但在高温下器件应按厂家降额曲线使用，通常超过环境 70℃ 后需线性降额直至最高允许温度。TCR ±100 ppm/℃ 在温区大幅变化时会引起阻值漂移，应在电路容许范围内评估温漂影响。
七、选型建议与替代
若需要更低温漂或更高精准度，可考虑金属膜/薄膜电阻或更高精度（±0.5% / ±0.1%）型号；若需更大功率，优先选更大封装（1206、2010等）或金属膜电阻。高压场合建议通过电阻网络设计分压或采用专用高压电阻。
八、采购与资料核实
在设计与批量采购前，建议下载松下官方数据手册核实完整规格与回流焊曲线、封装尺寸、公差与环境测试数据，并根据实际电路条件进行样机测试验证。
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