WMSIC Electronic Components

EG EG1160

ModelEG1160
PackageSOP-16
BrandEG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EG EG1160
Type
EG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EG
Electronic Component
EG1160
Electronic Component
1
Package
SOP-16
Electronic Component
(UVP); (OCP)
Electronic Component
Gate Driver IC
Electronic Component
0.28g
Electronic Component
1
Electronic Component
BM0265670002
Operating Temperature
45℃~+125℃
Operating Voltage
10V~20V
Load Type
MOSFET
Driver
Electronic Component
Current(IOH)
2.5A
Current(IOL)
2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EG1160栅极驱动芯片产品概述

一、产品定位与核心特性

EG1160是屹晶微(EG)推出的双通道半桥MOSFET栅极驱动芯片,专为中高压功率MOSFET的高效驱动设计。产品聚焦高可靠性、快速开关与多重保护,适配工业级宽温环境,可满足电力电子领域多场景的驱动需求。核心特性包括:双通道独立驱动、大灌/拉电流能力、快速开关速度、欠压/过流双重保护,以及宽电压/宽温工作范围。

二、关键电气参数详解

(1)驱动架构与通道能力

采用半桥驱动拓扑,支持2通道独立输出,可同时驱动上下桥臂MOSFET,简化功率电路的布局与设计,减少外围元件数量。

(2)驱动电流与开关速度

  • 灌/拉电流:峰值灌电流(IOL)达2A,峰值拉电流(IOH)达2.5A,充足的驱动能力可快速充放电MOSFET栅极电容,适配100A级以上大功率MOSFET,避免栅极充电不足导致的导通损耗;
  • 开关速度:上升时间(tr)120ns,下降时间(tf)80ns,快速开关特性可有效降低MOSFET的开关损耗,提升系统整体效率(尤其适用于高频应用场景)。

(3)工作电压与静态功耗

  • 工作电压范围:10V~20V,兼容12V、15V、20V等常见电源设计,灵活性强,无需额外电平转换电路;
  • 静态电流:典型值1mA,低静态功耗可减少待机状态下的能量损耗,适合对功耗敏感的系统(如便携式电源、储能设备)。

(4)输入兼容性

输入低电平(VIL)范围为-300mV~1V,兼容TTL、CMOS等多种数字信号源,抗干扰能力强,可稳定接收宽范围的输入信号,降低信号失真风险。

三、保护功能设计

EG1160内置双重核心保护机制,从电源与负载两端保障系统可靠性:

  1. 欠压保护(UVP):当工作电压低于内部设定阈值时,自动关断输出,防止因电源不足导致MOSFET驱动不足、导通损耗过大甚至烧毁;
  2. 过流保护(OCP):通过检测驱动回路电流,当电流超过阈值时快速关断输出,避免过流对MOSFET和负载造成不可逆损伤,保护电路安全。

四、应用场景适配

EG1160的参数特性使其适配多领域电力电子系统:

  • 工业电源:开关电源、DC-DC变换器、光伏并网逆变器;
  • 电机驱动:伺服电机、BLDC无刷电机、步进电机驱动电路;
  • 新能源领域:充电桩、储能系统(PCS)、新能源汽车辅助电源;
  • 通用电力电子:UPS不间断电源、焊接电源、感应加热设备。

五、封装与可靠性

  • 封装形式:SOP16(150MIL脚距),标准贴片封装,焊接工艺成熟,便于批量生产与组装;
  • 温度范围:-45℃~+125℃,覆盖工业级宽温环境,可在极端温度下稳定工作(如户外充电桩、 harsh工业现场);
  • 可靠性验证:经过严格的电应力测试、温度循环测试与老化测试,符合工业级可靠性标准,降低系统长期运行的故障率。

EG1160凭借高驱动能力、快速开关与多重保护,成为工业电力电子领域MOSFET驱动的高性价比选择,可有效提升系统效率与可靠性。

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