WMSIC Electronic Components

EVQ9P105M

ModelEVQ9P105M
PackageSMD,6x6.1mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC EVQ9P105M
Type
PANASONIC
Minimum package
2000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
EVQ9P105M
Electronic Component
1
Package
SMD,6x6.1mm
Electronic Component
Switch
Electronic Component
0.57g
Electronic Component
3.5N
Electronic Component
1
Electronic Component
BM0265002421
Electronic Component
Electronic Component
Electronic Component
3
Operating Temperature
40℃~+85℃
Switch
6.1mm
Switch
6mm
Switch
5mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

松下EVQ9P105M轻触开关产品概述

一、产品基本定位与品牌背景

松下EVQ9P105M属于Microswitch TACT系列轻触开关,是松下针对小型化、高密度PCB设计推出的SMD(表面贴装)型开关。作为全球电子元器件领域的成熟品牌,松下在微触开关领域拥有40余年工艺积累,EVQ9P105M延续了其“小体积、高可靠性、低功耗”的核心特点,主要面向低功率信号控制场景的设备设计,覆盖消费电子、工业仪器、汽车配件等多个领域。

二、核心性能参数解析

2.1 电气性能参数

该开关采用SPST(单刀单掷)常开结构(默认断开,触发后闭合),关键电气指标如下:

  • 额定触点电流:50mA(DC);部分工况兼容20mA(0.02A)/15VDC,适配数字电路的按键输入;
  • 额定电压:12V DC,避免超压导致触点绝缘下降;
  • 触点接触电阻:初始值≤100mΩ,确保信号传输无衰减;
  • 绝缘电阻:≥100MΩ(500V DC),满足基本电气安全要求。

2.2 机械性能参数

  • 触发作用力:3.5N(中等偏轻),既避免误触(比1~2N轻触开关更稳定),又适合频繁操作(如遥控器按键);
  • 封装尺寸:6.1mm(宽)×6mm(长)×5mm(高),体积小巧适配高密度PCB;
  • 按钮设计:圆形凸起,操作面积适中,手感舒适;
  • 引脚样式:J型立贴引脚,便于自动化贴片焊接;
  • 开关行程:3.5mm(下压距离),触发时产生清晰“咔嗒”反馈,提升操作确认感。

2.3 环境与寿命参数

  • 工作温度:-40℃~+85℃,覆盖户外低温(如智能手环)和家电高温(如加湿器内部)场景;
  • 工作寿命:3万次触发,满足一般消费电子(如遥控器1~2年使用)和工业轻负载需求;
  • 存储温度:-55℃~+100℃(参考官方 datasheet),便于仓储运输。

三、设计与安装特性

  1. 小体积高密度布局:6.1×6×5mm封装可紧凑排列在PCB上,适合智能手环、蓝牙耳机等空间受限设备;
  2. 立贴SMD优势:J型引脚无需手工插件,适配自动化生产线,降低焊接成本;
  3. 触点可靠性:采用松下“镀金触点+密封结构”,减少氧化和接触不良,长期使用稳定;
  4. 操作反馈明确:3.5mm行程+3.5N力值,触发时的机械反馈可避免误操作,尤其适合盲操作场景。

四、典型应用场景

EVQ9P105M的低功耗、小体积特性,使其成为以下场景的优选:

  1. 便携式消费电子:智能手环的心率监测/模式切换键、蓝牙耳机的接听/音量调节键;
  2. 小型家电与遥控器:电视迷你遥控器、空调遥控器、加湿器/小型风扇的控制面板键;
  3. 工业仪器:小型传感器节点、手持万用表的功能选择键、工业辅助控制面板键;
  4. 汽车电子配件:车载蓝牙适配器、点烟器充电器的控制键(符合汽车-40~+85℃温区要求)。

五、选型与使用注意事项

  1. 负载限制:仅适用于≤50mA/12V DC的信号控制,禁止直接驱动LED灯串、电机等大电流负载(易烧蚀触点);
  2. 焊接工艺:回流焊温度≤260℃(时间≤10秒),避免高温损坏内部结构;
  3. 误触防护:户外设备建议搭配硅胶按键帽,进一步降低误触概率;
  4. 寿命评估:若每天触发100次,3万次寿命可满足8~12个月使用,高频场景可选择松下高寿命系列(如EVQ系列10万次款)。

EVQ9P105M以其高性价比、小体积和稳定性能,成为轻触开关领域的经典选型,尤其适合对空间和成本敏感的小型电子设备设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.