Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ECPU1C474MA5
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PANASONIC ECPU1C474MA5
- Type
- PANASONIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ECPU1C474MA5
- Electronic Component
- 1
- Electronic Component
- 470nF
- Package
- 1206
- Electronic Component
- Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0263441358
- Operating Temperature
- 40℃~+85℃
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ECPU1C474MA5 产品概述
一、概述
ECPU1C474MA5 是松下（PANASONIC）系列中一款通用薄膜电容，标称容量 470nF，容差 ±20%，额定电压 16V，工作温度范围 -40℃ 至 +85℃，封装为 1206（英制）。该器件以薄膜介质实现电容功能，适用于对长期稳定性和低损耗有要求的中低电压电路。
二、主要性能特点
- 容量与精度：470nF ±20%，适用于一般滤波、耦合与退耦场合。
- 电压与温度：额定电压 16V，工作温度 -40℃~+85℃，适合消费电子与一般工业环境。
- 封装与安装：1206 SMD 封装，适配常见 PCB 自动贴装与回流焊工艺（1206 约等于 3.2×1.6mm，实际请参照厂商封装图）。
- 薄膜介质优势：相对电解电容，薄膜器件通常具有更低的漏电、较小的介质损耗及较好的寿命稳定性；与某些陶瓷材料相比，对直流偏置引起的电容衰减较小，性能更线性稳定。
三、典型应用场景
- 电源滤波与去耦：针对中低电压电源旁路，改善纹波与瞬态响应。
- 信号耦合与解耦：用于音频通道或模拟信号路径，提供较好的频率稳定性与低失真特性。
- 滤波与定时电路：RC 滤波、积分/微分回路中的稳定电容元件选择。
- 工业与消费类电子：温度范围和电压等级适配多数控制板、仪表与便携设备。
四、设计与使用建议
- 额定电压留有裕量：在关键电路中建议对额定电压进行适当降额（如使用电压不超过额定的 70%～85%），以提高长期可靠性。
- PCB 布局：去耦时尽量将电容放置于被去耦元件引脚附近并缩短引线长度，使用充分的焊盘与过孔以降低寄生电感。
- 焊接与回流：遵循松下推荐的回流温度曲线与次数限制，避免过高温度或多次重复回流导致性能退化。
- 贮存与处理：干燥环境存放，避免潮湿与强光直射；贴装前若为吸湿包装，应按厂商说明进行回烘处理。
五、选型注意事项
- 容差：±20% 为通用等级，若电路对精度敏感应选择更小容差的型号或采用配合校准手段。
- 温度与环境：若工作环境超过 +85℃ 或存在高温潮湿场景，应选用高温等级或具相应可靠性认证的器件。
- 替代与比较：与陶瓷电容相比，薄膜电容在稳定性和损耗方面常更有优势；与电解电容比较则在寿命与频率特性上更适合中高频和精密信号路径。
六、总结
ECPU1C474MA5 作为一款 1206 封装的薄膜电容，凭借 470nF 容量、16V 额定与宽温范围，适合用于一般消费及工业电子的滤波、耦合与去耦应用。设计时注意电压降额、合理布局及按厂商焊接规范处理，可获得稳定的长期性能。有关更详细的电气参数、封装尺寸及焊接曲线，请参照松下官方数据手册以确保设计与生产合规。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
