Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJ3EKF3302V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJ3EKF3302V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJ3EKF3302V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 33kΩ
- Electronic Component
- 1
- Electronic Component
- BM0209723889
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ3EKF3302V 厚膜贴片电阻产品概述
一、产品基本属性识别
ERJ3EKF3302V是松下（PANASONIC）推出的厚膜贴片电阻，型号编码直接关联核心属性：
- 系列标识：“ERJ”为松下厚膜电阻通用系列；
- 规格编码：“3E”对应封装与功率组合，“KF”代表±1%精度等级；
- 阻值标识：“3302”表示标称阻值为33kΩ（330×10²Ω）；
- 性能后缀：“V”对应±100ppm/℃温度系数。
该产品采用0603封装（英制0.06×0.03英寸，公制1.6×0.8mm），属于小型化贴片电阻范畴，适配高密度PCB布局需求。
二、核心性能参数详解
1. 阻值与精度
标称阻值33kΩ，精度±1%——该精度属于常规精密级，可满足大多数电子电路对阻值误差的要求（如信号分压、偏置电路、滤波网络等场景，避免因阻值偏差导致的性能波动）。
2. 功率等级
额定功率100mW——为0603封装贴片电阻的典型功率规格，适用于低功耗电路设计（如微控制器I/O口限流、传感器信号调理、小型电源模块辅助电路等）。
3. 温度系数
±100ppm/℃——即温度每变化1℃，阻值变化量为33kΩ×100×10⁻⁶=3.3Ω。该稳定性可有效降低温度波动对电路性能的影响，适合温度变化较大的环境（如工业现场、户外设备）。
4. 工作温度范围
-55℃至+155℃——覆盖工业级温度标准，可在极端环境下稳定工作（如汽车辅助系统、户外通信设备等）。
三、封装与典型应用场景
0603封装具有体积小、重量轻、焊接兼容性强的特点，适配SMT自动化生产，典型应用场景包括：
- 消费电子：智能手机、平板的电源滤波、信号分压电路；
- 工业控制：传感器接口偏置电阻、小型PLC输入输出限流；
- 汽车电子：车载辅助系统（倒车雷达、胎压监测）低功耗电路；
- 通信设备：小型基站、路由器射频前端辅助电路。
四、可靠性与环境适应性
作为厚膜贴片电阻，ERJ3EKF3302V具备以下可靠性优势：
- 抗机械应力：贴片封装焊接强度高，可承受运输、使用中的冲击振动；
- 长期稳定性：宽温度范围+低温度系数结合，长期使用阻值漂移小，保证电路一致性；
- 耐环境性能：厚膜工艺耐湿、耐腐蚀，适应潮湿、多尘等复杂环境；
- 质量一致性：松下严格生产管控，批量产品参数偏差极小，降低调试难度。
五、品牌与产品优势
松下作为全球电子元器件龙头，该产品具备：
- 环保合规：符合RoHS、REACH标准，无铅焊接兼容；
- 可靠性验证：通过高温老化、温度循环等严苛测试，寿命长；
- 技术支持：完善的应用文档与技术服务，方便客户快速集成；
- 批量供应：稳定产能保障，满足大规模生产需求。
ERJ3EKF3302V凭借小型化、高精度、宽温稳定等特点，成为低功耗电路设计的常用选型，适配多领域电子设备的可靠性需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
