WMSIC Electronic Components

EEEFTH101XAP

ModelEEEFTH101XAP
PackageSMD,D6.3xL7.7mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC EEEFTH101XAP
Type
PANASONIC
Minimum package
900 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
EEEFTH101XAP
Electronic Component
1
Electronic Component
100uF
Package
SMD,D6.3xL7.7mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
0.882g
Electronic Component
1
Electronic Component
BM69415659
Electronic Component
2000hrs@105℃
Operating Temperature
55℃~+105℃
Current
350mA@100kHz
Voltage
50V
Capacitor
6.3mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EEEFTH101XAP 产品概述

产品简介

EEEFTH101XAP是松下(PANASONIC)公司推出的一款高性能贴片型铝电解电容器,采用表面贴装技术(SMD/SMT)。其额定电压为50V,电容值为100μF,电容器的额定容量在环境温度和频率变化时能够保持稳定,有助于提升电子设备的性能和可靠性。该产品的尺寸规格为直径6.3mm,长度7.7mm,符合现代电子设备蓝图设计的需求。

产品特点

  1. 高性能电容值:100μF的电容值使得EEEFTH101XAP适合用于需要较大电容的应用,能够有效平滑电源电压,降低电源波动,极大提升电路的稳定性。

  2. 宽额定电压范围:其额定电压为50V,适合用于众多需要高电压电源的设备中,比如电源供应器、LED驱动及消费电子产品等。

  3. 优异的频率特性:在100kHz的使用频率下,该电容器能够承受350mA的高纹波电流,展示出极佳的频率响应特性。这一特性使得该电容在高频电流应用中尤为出色,确保高效的信号处理和供电。

  4. 紧凑的封装尺寸:D6.3×L7.7mm的紧凑设计使得其在空间受限的应用场合表现优异,例如在移动设备、小型电子产品及高密度电子组件中,能够有效节省PCB设计空间。

  5. 耐环境能力强:此款电容器具备良好的耐高温和耐湿性能,适合在多变的工作环境中发挥作用,确保设备长期稳定运行。

应用场景

EEEFTH101XAP的应用范围广泛,能够适用于各种电子设备。以下是几个具体应用案例:

  1. 电源管理:在开关电源、DC-DC转换器等电源管理模块中,EEEFTH101XAP常常用作滤波和电源平滑,提供稳定的电压输出。

  2. 消费电子:在智能手机、平板电脑、数字相机等消费电子产品中,作为能量存储元件帮助维持电源稳定性,为设备提供顺畅的性能。

  3. LED驱动电路:LED照明设备中,EEEFTH101XAP可以作为驱动电路中的平滑电容,确保LED获得稳定的电流,提升照明效果和使用寿命。

  4. 通讯设备:在路由器、基站及其他通讯设备中,该电容器能够稳定电源,降低信号干扰,提高数据传输的稳定性。

结论

EEEFTH101XAP是高质量、高性能的贴片型铝电解电容器,凭借其优异的电气特性、紧凑的设计和广泛的应用范围,成为现代电子设备不可或缺的一部分。松下品牌的可靠性和技术支持,更加确保了其在电子元器件市场中的竞争力。无论是用于电源管理、消费电子还是通讯设备,EEEFTH101XAP均能完美胜任,满足各类电子设计工程师的需求。对于追求高性能和可靠性的电子应用场景,EEEFTH101XAP无疑是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.