WMSIC Electronic Components

ECHU1C104JX5

ModelECHU1C104JX5
Package1210
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ECHU1C104JX5
Type
PANASONIC
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ECHU1C104JX5
Electronic Component
1
Electronic Component
100nF
Package
1210
Electronic Component
Capacitor
Electronic Component
±5%
Electronic Component
0.055g
Electronic Component
1
Electronic Component
Electronic Component
Electronic Component
BM0264567924
Operating Temperature
55℃~+125℃
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ECHU1C104JX5 产品概述

一、产品简介

ECHU1C104JX5 是松下(PANASONIC)系列的一款金属化聚苯硫醚(PPS)薄膜电容,标称电容量 100nF(0.1µF),容差 ±5%,额定电压 16V,工作温度范围 -55℃~+125℃,常见封装为 1210 贴片型。该器件以稳定的电气性能和优良的环境适应性,适合在中低压、高可靠性要求的电子电路中长期使用。

二、主要性能与规格

  • 电容量:100nF(0.1µF)
  • 精度:±5%
  • 额定电压:16V DC
  • 介电材料:金属化聚苯硫醚(Metallized PPS)
  • 工作温度:-55℃ ~ +125℃
  • 封装形式:1210 贴片(表面贴装)

三、材料与结构特点

金属化PPS薄膜作为介质具备低介质损耗、良好的介电稳定性和较高的绝缘电阻。金属化工艺使电容具有自愈性:局部击穿处可通过薄金属层蒸发实现自我修复,提升可靠性。薄膜结构相较于电解电容,具有更长的寿命和更小的温漂特性。

四、温度与可靠性

工作温度范围宽,低温和高温下电容量保持稳定;对湿度和热循环具有较强耐受性,适合汽车电子、工业控制等要求长期可靠性的场合。建议在设计中考虑温度系数与电压系数对实际电容量的影响。

五、典型应用场景

适用于旁路/去耦、滤波、信号耦合与时钟网络等场合,尤其适合对稳定性和寿命有要求的消费电子、通信设备、工业控制及汽车电子(在符合车规认证前提下)等领域。

六、封装与焊接建议

1210 尺寸便于自动贴装与回流焊接。推荐遵循厂家回流焊温度曲线,避免过高峰值温度和过长热暴露时间,以免损伤薄膜或金属化层。贴片过程中尽量避免弯曲、撞击和局部机械应力。

七、选型与替代建议

选型时除容量、电压和封装外,应关注温度范围、介质类型与寿命要求。可替换为同等规格的金属化PPS薄膜电容或其他低损耗薄膜电容,选用时确认封装引脚形式与工作环境一致。

八、注意事项与存储

存放于干燥、常温、避免阳光直射的环境,防止潮湿和腐蚀性气体。长时间存储后使用前建议进行外观检查与必要的电气测试。

九、小结

ECHU1C104JX5 以 100nF/±5%/16V 的规格,结合金属化PPS薄膜的稳定性与自愈特性,为要求长期可靠性与低损耗的电路提供了优秀的被动元件选项。在设计和生产中遵循封装与焊接规范、考虑温度与电压系数,可获得最佳的长期性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.