WMSIC Electronic Components

16SVPG47M

Model16SVPG47M
PackageCan - SMD
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC 16SVPG47M
Type
PANASONIC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
16SVPG47M
Electronic Component
1
Electronic Component
47uF
Package
Can - SMD
Type
Electronic Component
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
0.24g
Electronic Component
1
Electronic Component
BM0264911683
Electronic Component
5000hrs@105℃
Operating Temperature
55℃~+105℃
Current
160mA@120Hz
Voltage
16V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PANASONIC 16SVPG47M 产品概述

一、产品简介

PANASONIC 型号 16SVPG47M 为 47µF、额定电压 16V 的铝电解聚合物电容器(Aluminum Polymer)。封装为径向 Can 式且适用于表面贴装(SMD)工艺,电容体直径约 5mm、长度约 4.5mm。工作温度范围 -55℃ 至 +105℃,设计寿命为 5000 小时(105℃ 下)。

二、主要参数

  • 容值:47 µF
  • 额定电压:16 V
  • 容差:±20%
  • 等效串联电阻(ESR):约 25 mΩ
  • 纹波电流:160 mA @ 120 Hz
  • 工作温度:-55℃ ~ +105℃
  • 寿命:5000 hrs @ 105℃
  • 类型:铝聚合物(低 ESR)
  • 尺寸:直径 5 mm,长度 4.5 mm
  • 品牌:PANASONIC(松下)

三、关键特性与优势

  1. 低 ESR:约 25 mΩ 的等效串联电阻提供优秀的高频旁路和瞬态响应能力,适合对纹波与稳定性要求高的电路。
  2. 铝聚合物材料:相较于传统铝电解电容,聚合物有更低的阻抗、更好的温度特性与更稳定的容量随时间衰减特性。
  3. 宽温与较长寿命:-55℃~+105℃ 的工作温度和 5000 小时的高温寿命,适应工业级环境应用。
  4. 紧凑封装:小直径与短长度便于在空间受限的板上实现高密度布局,适合 SMD 生产线。

四、典型应用场景

  • 开关电源输入/输出滤波与去耦
  • DC-DC 转换器旁路与储能
  • 通信设备、电源管理模块与工业控制板
  • 对纹波电流、启动/瞬态响应有较高要求的场合

五、使用与安装建议

  • 建议遵循厂商的回流焊工艺规范,避免过高的峰值温度与过长的加热时间以保护内部聚合物材料。
  • 放置时避免机械应力(挤压、弯折)和强烈振动,以免影响封装或内部接触。
  • 设计 PCB 时参考厂商推荐的焊盘尺寸与布局,保证良好焊接质量与热散逸。
  • 对于关键电源应用,考虑并联同系列或不同类型电容以优化低频容值与高频 ESR 特性。

六、可靠性与选型提示

16SVPG47M 以低 ESR 与中等容量为特长,适合需要快速响应和较高纹波承受能力的电源节点。若系统工作在更高温或需更长寿命,应选用更高额定温度/寿命等级的产品;若需更大纹波电流或更低 ESR,可考虑并联多个电容或选用更大规格的聚合物电容。

如需进一步的电气特性曲线、回流焊曲线或封装尺寸图,请参考 PANASONIC 官方数据手册,以保证设计与制造符合器件规范。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.