WMSIC Electronic Components

EEEFK0J101UR

ModelEEEFK0J101UR
PackageSMD
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC EEEFK0J101UR
Type
PANASONIC
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
EEEFK0J101UR
Electronic Component
1
Electronic Component
100uF
Package
SMD
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
0.525g
Electronic Component
1
Electronic Component
BM0264570366
Electronic Component
2000hrs@105℃
Operating Temperature
55℃~+105℃
Current
120mA@120Hz
Voltage
6.3V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EEEFK0J101UR 产品概述

一、产品简介

Panasonic(松下)EEEFK0J101UR 是一款贴片铝电解电容,额定容量 100 μF,容差 ±20%,额定电压 6.3 V。典型小型化 SMD 封装(约 5 × 5.8 mm),面向对体积、可靠性有要求的功率去耦与滤波应用。长期工作温度范围 -55 ℃ 到 +105 ℃,在 105 ℃ 下寿命 2000 小时,适合一般工业与消费类电子产品使用。

二、主要参数

  • 容值:100 μF(±20%)
  • 额定电压:6.3 V DC
  • 纹波电流:120 mA @ 120 Hz
  • 工作温度:-55 ℃ ~ +105 ℃
  • 工作寿命:2000 hrs @ 105 ℃
  • 封装:SMD,约 5 × 5.8 mm
  • 品牌:PANASONIC(松下)

三、电气与热学特性说明

纹波电流 120 mA(标注频率 120 Hz)表明在该条件下器件能承受的交流分量能力。实际设计中应注意:纹波电流会在电容内部产生热量,长期接近额定纹波会加速电解质老化并缩短寿命。额定寿命 2000 小时(105 ℃)表明该型号为高温型电解电容,温度每降低一定区间寿命显著延长,设计时可通过降额和热管理提高可靠性。

四、封装与工艺注意

5×5.8 mm 的 SMD 封装适合自动贴片与回流焊工艺。焊接时请严格遵循松下的回流曲线与预热要求,避免超过峰值温度或快速冷却引起应力。若电容长期暴露于潮湿环境,建议在回流前进行烘烤以防焊接缺陷或气泡。

五、典型应用场景

适用于移动设备电源滤波、稳压器输出去耦、音频电源缓冲、通信设备、工控模块等体积受限且需稳定低电压电源的场合。由于工作温度覆盖 -55~105 ℃,也可用于一般工业环境的开关电源和嵌入式系统。

六、选型与使用建议

  • 对纹波与寿命有较高要求的场合,建议在电压和纹波电流上留有裕量(例如额定电压降额、实际纹波低于标称值)。
  • 设计时关注电容周边散热与换热,避免长期高温。
  • 对关键电路,在并联多只小容量电容以降低等效 ESR/ESL 的方法常用以提高纹波处理能力。
  • 选购与替换时请以原厂最新 datasheet 为准,关键项目(如 ESR、耐振动等)应确认具体数值。

七、可靠性与储存

建议按厂商推荐条件储存,避免高温高湿与强酸碱环境。长期库存前如有潮气应按资料要求烘烤。产品在使用过程中应避免超过最大额定电压和极限温度,定期测试关键设备的电容性能可预防失效带来的系统故障。

八、采购与替代

EEEFK0J101UR 为松下品牌件号,购买时可通过授权经销商或原厂渠道获取。若需规格匹配的替代品,关注容值、电压、纹波电流、温度等级、寿命及封装尺寸等关键参数,优先选择同等级工业规格的厂商型号并验证实际 ESR 与寿命表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.