Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EEEFC1H221P 贴片型铝电解电容是松下(Panasonic)公司推出的一款高性能铝电解电容,具备优良的电气特性和高可靠性。该产品以其适中的尺寸和卓越的性能,成为各类电子设备中不可或缺的元器件之一。
较高的电压额定值:本电容提供50V的额定电压,适用于多种电子应用场合,尤其是在电源管理和信号处理等领域。
大容量和纹波电流:220μF的高容值使得EEEFC1H221P非常适合于需要高电流和大储能的应用。375mA的纹波电流能力适合许多工业和消费电子产品,确保电流稳定并防止因过载导致的电容损坏。
紧凑的封装设计:该电容采用SMD封装,尺寸为直径10mm和长度10.2mm,适合现代电子设备对空间的严格要求。SMD设计方便贴装,适合自动化生产线,提高了整体生产效率。
耐环境性:此款电容由铝合金制成,并采用特殊的电解液,能够在较宽的温度范围内(-40°C至+105°C)保持稳定的性能,适应各种极端使用环境。
长寿命:松下的铝电解电容以其出色的品质著称,EEEFC1H221P特别设计以延长使用寿命,通常可在额定温度下获得长达2000小时的使用寿命,降低维护频率和更换成本。
EEEFC1H221P 贴片型铝电解电容广泛应用于多种电子产品和系统中,包括但不限于以下领域:
电源管理:在开关电源、AC-DC适配器及其他电源转换器中用于平滑输出电压和降低纹波。
消费电子:如电视、音响系统及其他家庭娱乐设备中用于保持稳定的电源供应,提高设备运行的可靠性和性能。
工业设备:用于PLC、驱动器和运动控制系统中,提供必要的能量储备以支持动态负载及瞬态响应。
通信设备:在基站设备及网络交换机中,确保信号稳健,发挥其滤波和能量蓄存的作用。
汽车电子:应用于汽车电子控制单元、LED照明和信息娱乐系统中,提升车辆的智能化及舒适性。
EEEFC1H221P 贴片型铝电解电容以其出色的电气特性、可靠的性能以及广泛的应用潜力,成为电子设计工程师在开发新设备时的重要选择。松下品牌的良好声誉和客户信赖,使其成为业界标准之一,助力创新与高效能的电子应用的实现。在日趋小型化和高性能要求的电子产品市场中,EEEFC1H221P凭借其优越的特点,将能够满足各种应用的需求,是专业设计师和制造商的理想选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products