Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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ERJ3EKF1001V 是松下(Panasonic)公司推出的一款高性能贴片电阻。它的基本参数包括额定功率为100mW,电阻值为1kΩ,精度达到±1%。该型号采用厚膜电阻技术,适合多种电子电路应用,具有良好的可靠性和稳定性。
额定功率与功耗:ERJ3EKF1001V的额定功率为100mW,适合在低功耗电路中使用。它能够在一定程度上承受功率损耗,这使得它在许多便携式和小型电子设备中成为理想的选择。
温度范围:其工作温度范围为-55℃至+155℃,让其在极端环境下也能正常运作。这一特性使得该电阻在汽车电子、工业自动化和航天领域得到了广泛应用,能够经受恶劣的工作条件和温度变化。
温度系数:ERJ3EKF1001V的温度系数为±100ppm/℃,在其使用温度范围内,电阻值的变化相对较小,确保了电路在不同温度下的一致性和稳定性。这一特性对于需要高精度和高稳定性的应用毫无疑问是一个巨大的优势。
电阻类型及精度:作为厚膜电阻,其电阻值具有±1%的精度,能够满足大部分应用的要求。厚膜技术不仅使得电阻拥有更好的性能,还使得其在体积和成本上相对具有优势。
封装尺寸:该电阻采用0603封装形式,其尺寸为1.6mm x 0.8mm,这使得它在现代电子设备中具有更加灵活的应用空间,适合微型化设计需求,便于在PCB(印刷电路板)上进行集成和布置。
品牌信誉:松下作为一个全球知名的电子元器件制造商,在品质和技术实力上得到了广泛的认可。ERJ3EKF1001V系列贴片电阻确保了高质量和长期可靠性,让设计工程师在选择时可以更加放心。
ERJ3EKF1001V贴片电阻因其优越的性能和广泛的适用性,适用于多种领域,包括但不限于:
ERJ3EKF1001V是一款功能强大且适用范围广泛的贴片电阻。凭借其100mW的功率、1kΩ的电阻值、优越的温度特性以及小巧的0603封装,松下的这款贴片电阻解决方案在设计和工程应用中都展示出了卓越的性能表现。无论是在汽车、消费者电子、工业自动化还是医疗设备等领域,ERJ3EKF1001V都能够满足高性能和高可靠性的需求,成为设计师和工程师在相关项目中的首选元件。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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