WMSIC Electronic Components

AXK5A2137YG

ModelAXK5A2137YG
PackageSMD,P=0.5mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
PANASONIC AXK5A2137YG
Type
PANASONIC
Unit
Electronic Component
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
AXK5A2137YG
Electronic Component
1
Package
SMD,P=0.5mm
Electronic Component
2
Electronic Component
and Connector
Electronic Component
0.8g
Electronic Component
0.5mm
PIN
120P
Electronic Component
1
Electronic Component
BM0264570346
Electronic Component
Electronic Component
Operating Temperature
55℃~+85℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AXK5A2137YG 产品概述

产品简介

AXK5A2137YG 是一款由 PANASONIC(松下)生产的高密度表面贴装型连接器,专为现代电子设备设计,以满足对小型化、高可靠性和高性能的需求。该连接器采用插口类型,具有120个针位,适用于需要高密度互连的应用场景。

主要特性

  1. 高密度设计:AXK5A2137YG 提供120个针位,间距仅为0.020"(0.50mm),适合在有限空间内实现高密度连接。
  2. 表面贴装技术(SMT):采用表面贴装型安装方式,便于自动化生产,提高生产效率并减少人工成本。
  3. 板导轨设计:配备板导轨,确保连接器在安装过程中的稳定性和精确性,减少安装误差。
  4. 镀金触头:触头表面经过镀金处理,提供优异的导电性和耐腐蚀性,确保长期稳定的电气连接。
  5. 多种堆叠高度:提供3mm和3.5mm两种接合堆叠高度,适应不同的设计需求。
  6. 低板上高度:板上高度仅为0.085"(2.16mm),有助于实现更薄的产品设计。

应用领域

AXK5A2137YG 适用于多种高密度互连的应用场景,包括但不限于:

  • 消费电子产品:如智能手机、平板电脑、笔记本电脑等,满足其小型化和高性能的需求。
  • 通信设备:用于基站、路由器、交换机等设备,提供可靠的信号传输。
  • 工业控制:在工业自动化设备中,确保高密度和稳定的电气连接。
  • 医疗设备:用于高精度的医疗仪器,提供可靠的信号传输和电气连接。

技术规格

  • 连接器类型:插口,中央触点带
  • 针位数:120
  • 间距:0.020"(0.50mm)
  • 排数:2
  • 安装类型:表面贴装型
  • 特性:板导轨
  • 触头表面处理:镀金
  • 接合堆叠高度:3mm,3.5mm
  • 板上高度:0.085"(2.16mm)

优势与特点

  • 高可靠性:镀金触头和板导轨设计确保了连接的高可靠性和长期稳定性。
  • 易于安装:表面贴装技术简化了安装过程,提高了生产效率。
  • 灵活设计:多种堆叠高度和低板上高度提供了设计灵活性,适应不同的应用需求。
  • 广泛适用性:适用于多种高密度互连的应用场景,满足不同行业的需求。

结论

AXK5A2137YG 是一款高性能、高密度的表面贴装型连接器,适用于多种现代电子设备。其高可靠性、易于安装和灵活设计使其成为高密度互连应用的理想选择。无论是消费电子产品、通信设备、工业控制还是医疗设备,AXK5A2137YG 都能提供稳定可靠的电气连接,满足各种设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.