WMSIC Electronic Components

PANJIT PJA3402_R1_00001

ModelPJA3402_R1_00001
PackageSOT-23
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT PJA3402_R1_00001
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
PJA3402_R1_00001
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0227686045
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.25W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PJA3402_R1_00001 产品概述

PJA3402_R1_00001 是 PANJIT(强茂)出品的一颗 SOT-23 封装 N沟道场效应晶体管,面向低电压开关与功率管理应用。器件在 30V 漏源耐压下,提供较低的导通电阻与适中的开关性能,适合移动电源、负载开关、DC-DC 降压与小功率马达驱动等场景。

一、主要规格摘要

  • 类型:N沟道 MOSFET(SOT-23,单个)
  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:4.4A(注:受封装散热限制)
  • 导通电阻 RDS(on):37mΩ @ Vgs=10V
  • 最大耗散功率 Pd:1.25W(在标准测试环境下)
  • 阈值电压 Vgs(th):0.72V @ Ids=250µA
  • 总栅极电荷 Qg:11.3nC @ Vgs=10V
  • 输入电容 Ciss:447pF;输出电容 Coss:34pF;反向传输电容 Crss:22pF
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOT-23

二、特性与性能要点

  • 低导通电阻:在 Vgs=10V 时 RDS(on) 为 37mΩ,可降低导通损耗,适合需要较低导通压降的低压大电流路径。
  • 适中开关能耗:总栅极电荷 Qg=11.3nC(10V)和 Ciss=447pF 表明器件在中高速开关中表现平衡,适合开关频率不是极高的降压转换器或开关场合。
  • 30V 耐压等级:可覆盖常见 12V、24V 系统的开关与保护应用。
  • 小封装 SOT-23:适合板面空间受限的便携设备,但散热能力有限,需合理 PCB 设计以提升热耗散能力。

三、典型应用场景

  • 低压 DC-DC 降压转换器(作为同期整流或开关元件,需考虑热管理与驱动)
  • 便携设备负载开关与电源切换
  • 小型直流电机/舵机驱动(低功率场景)
  • 保护电路与过流断路器(与检测电路配合)
  • 通用开关元件替换与原型开发

四、设计与使用建议

  • 驱动电压:为达到规格化的 RDS(on),建议采用 10V 门极驱动;若使用 5V 或逻辑电平驱动,应验证在该 Vgs 下的导通电阻与温升。
  • 热管理:Pd=1.25W 是在标准条件下测得,SOT-23 封装散热受限。高电流持续工作时需增大焊盘铜箔面积、使用散热层或多层 PCB 并配合过孔散热。
  • 开关噪声控制:为减少振铃与过冲,建议在门极串联小电阻(如 10–100Ω),并在必要时使用 RC 或 TVS 吸收抑制高 dv/dt。
  • 布局要点:尽量缩短源-漏回路路径、增大电流承载铜宽,漏源间采用低阻抗走线;门极走线尽量短以降低寄生电感。
  • 安全裕量:连续电流额定值受环境温度和 PCB 散热影响,选型时以实际热阻与工作温度为准,并考虑短时冲击电流能力。

五、封装与可靠性

SOT-23 小封装有利于节省空间,但限制了热耗散。器件工作温度范围宽(-55℃ 至 +150℃),适应严苛温度环境;在高温、高电流场合应评估长期可靠性并做好热仿真验证。

总结:PJA3402_R1_00001 在 30V/4.4A 等级下,提供了低 RDS(on) 与适中开关性能,适用于空间受限且需中等功率处理的开关与电源管理应用。合理的驱动、PCB 散热与抗干扰设计将显著提升其实际应用表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.