WMSIC Electronic Components

PANJIT BX320_R1_00001

ModelBX320_R1_00001
PackageSMA(DO-214AC)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT BX320_R1_00001
Type
PANJIT
Minimum package
1800

Technical parameters

Electronic Component
PANJIT
Electronic Component
BX320_R1_00001
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Schottky Diode
Electronic Component
0.089g
Electronic Component
1
Electronic Component
BM0262576575
Current
3A
Diode
1
Current(Ir)
50uA@200V
(Vf)
900mV@3A
Electronic Component
65℃~+175℃
Electronic Component
1800
Voltage Rating(Vr)
200V
Surge Current (Ifsm)
80A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BX320_R1_00001 产品概述

BX320_R1_00001 是 PANJIT(强茂)推出的一款高压肖特基整流二极管,适用于需要高速整流、抗浪涌能力和宽温度范围的电源与保护电路。该器件在 3A 工作电流条件下具有 900mV 的典型正向压降,并能承受高达 200V 的反向电压,结合较低的反向漏电与良好的耐温性能,适合工业级和高可靠性应用。

一、主要参数概述

  • 型号:BX320_R1_00001
  • 品牌:PANJIT(强茂)
  • 器件类型:肖特基二极管(Schottky)
  • 正向压降 (Vf):900mV @ If = 3A
  • 直流反向耐压 (Vr):200V
  • 整流电流:3A(平均整流电流)
  • 非重复峰值浪涌电流 (Ifsm):80A
  • 反向电流 (Ir):50 µA @ 200V
  • 工作结温范围:-65°C ~ +175°C
  • 封装:SMA (DO-214AC)(以实际数据手册为准)

二、结构与封装说明

BX320_R1_00001 采用常用的 SMA(DO-214AC)表面贴装封装,适合自动化贴片与回流焊工艺。SMA 封装在小型化电源设计中提供了良好的热扩散路径和机械强度,便于在有限面积的 PCB 上实现稳健的热管理。注意最终设计时应参考制造商的封装图与推荐的 PCB 焊盘尺寸。

三、性能亮点

  • 高压耐受:200V 的反向耐压使该肖特基器件可用于中高压整流与保护场合,扩展了肖特基应用的电压上限。
  • 低正向压降:在 3A 工作点下典型 Vf 为 0.9V,有利于降低整流功耗与发热,相比传统硅整流器可减少能量损耗。
  • 快速恢复特性:肖特基结本身几乎无存储电荷,实现高速开关与低逆恢复损耗,适合开关电源与高频整流。
  • 优良的浪涌承受力:80A 的非重复峰值浪涌能力,有利于吸收启动或短时过载产生的瞬态电流。
  • 宽温度工作:-65°C 至 +175°C 的结温范围适应高温环境与恶劣工况,提高了系统可靠性。

四、典型应用场景

  • 开关电源(SMPS)整流与续流二极管
  • DC-DC 转换器的输出整流、回路续流
  • 逆极性与电源保护电路
  • 消费类电源适配器、工业电源模块
  • 电池充放电保护、太阳能逆变器的防反接保护
  • 需要高压耐受与中等电流整流的嵌入式与通信设备

五、设计与 PCB 布局建议

  • 热管理:尽量增大二极管焊盘区域并连通底层大铜箔,以降低结-周围温升。必要时在焊盘区布置过孔连接多层内层散热铜箔。
  • 导线与走线:在高电流回路中采用宽且短的铜迹以降低压降与发热;浪涌路径应尽量缩短。
  • 去耦与旁路:在高速开关应用中靠近器件放置滤波电容,减少高频应力并稳定电压。
  • 焊接工艺:遵循厂商推荐的回流焊曲线,避免超温或重复高温循环影响器件寿命。
  • ESD 与过流保护:在静电敏感环境或可能出现异常过流的场合,配合适当的熔断器或限流措施使用。

六、选型与可靠性注意事项

  • 同类比较:与传统硅整流二极管相比,肖特基在正向压降和开关损耗上有优势;与低压肖特基相比,200V 型在反向漏电通常更高,应根据系统漏电容忍度评估。
  • 温度影响:反向漏电随温度上升显著增加,在高温或高 Vr 条件下需关注漏电产生的静态损耗与热失控风险。
  • 浪涌能力:Ifsm 80A 为非重复峰值,应避免在长期重复冲击下使用,设计时应考虑重覆盖与热累积。
  • 认证与测试:若用于汽车或关键工业应用,确认器件是否具备相应的认证或已通过相关可靠性测试。

七、结语与采购参考

BX320_R1_00001 为一款针对中高压、需兼顾高速整流与稳健耐温的肖特基二极管,适合用于开关电源、保护与工业电源设计。欲获得完整电气特性曲线、热阻数据与封装尺寸,请参阅 PANJIT 官方数据手册或向授权代理商索取样品与技术支持。

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