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PANJIT PJA3406_R1_00001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT PJA3406_R1_00001
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- PJA3406_R1_00001
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0257375170
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.25W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
- Capacitor(Ciss)
- 235pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PJA3406_R1_00001 产品概述
一、产品简介
PJA3406_R1_00001 是强茂（PANJIT）推出的一款 N 沟道场效应管（MOSFET），集成于小型 SOT-23 封装，适用于低电压开关与功率管理场景。器件额定漏源电压为 30V，具备较低的导通电阻与适中的门极电荷，兼顾开关性能与驱动能耗，便于在空间受限的板级电源与驱动电路中应用。
二、主要参数
- 类型：N 沟道 MOSFET（单只）
- 漏源耐压 Vdss：30V
- 连续漏极电流 Id：4.4A（器件极限，受封装散热限制）
- 导通电阻 RDS(on)：70mΩ @ Vgs=4.5V（测试电流 2.8A）
- 最大耗散功率 Pd：1.25W（SOT-23 封装，环境依赖）
- 阈值电压 Vgs(th)：约 1V
- 总门极电荷 Qg：5.8nC @ Vgs=15V（驱动能耗参考）
- 输入电容 Ciss：235pF @ 15V
- 反向传输电容 Crss：24pF @ 15V
- 工作温度范围：-55℃ ~ +150℃
- 封装：SOT-23
三、关键特性
- 低压耐受：30V 额定适合常见的 12V/24V 系统边缘保护与低压开关。
- 低导通阻抗：70mΩ（4.5V 驱动）在中小电流下损耗较低，提升效率。
- 适中门极电荷：Qg=5.8nC，兼顾快速开关与较低驱动功耗，适用于驱动能力有限的 MCU/驱动芯片。
- 小体积封装：SOT-23 尺寸利于高密度 PCB 布局与成本控制。
四、典型应用场景
- 便携式电源开关与负载开关（电池管理、便携设备）
- 低压 DC-DC 转换器的同步或补偿开关（注意热设计）
- 通用开关管、继电器驱动、负载断开保护
- 信号级负载控制与电平移位场合
五、封装与热管理
SOT-23 封装带来体积与成本优势，但热阻较高。器件 Pd=1.25W 是在良好散热条件下的额定耗散，实际应用时应通过铜箔加大散热区域、采用多层接地/电源平面或并联器件来降低结温。对连续大电流负载推荐进行热仿真与实测验证。
六、使用建议与可靠性
- 驱动电压：若需最低 RDS(on)，推荐 Vgs=4.5V 或更高驱动电压，但须参考系统能承受的门极电压。
- 开关速度：Ciss 与 Crss 决定了开关性能与米勒效应，设计栅极阻抗与驱动能力时应兼顾电磁干扰（EMI）与切换损耗。
- 长期可靠性：工作温度范围宽，适合工业级场合；但请避免长期在最大结温附近工作以延长寿命。
- ESD 与焊接：遵循常规静电敏感器件（ESD）防护与回流焊曲线规范。
七、采购与注意事项
PJA3406_R1_00001 以 PANJIT 强茂品牌供应，SOT-23 小封装适合批量贴片生产。采购时请确认完整型号与批次信息，索取完整数据手册与封装图，必要时在目标应用条件下进行样片评估与热测，以确保性能符合系统要求。
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