Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT SR24_R1_00001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT SR24_R1_00001
- Type
- PANJIT
- Minimum package
- 1800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- SR24_R1_00001
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.109g
- Electronic Component
- 1
- Electronic Component
- BM0222568243
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 200uA@40V
- (Vf)
- 500mV@2A
- Electronic Component
- Electronic Component
- Electronic Component
- 1800
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SR24_R1_00001 - PANJIT 肖特基二极管
1. 产品简介
SR24_R1_00001 是一款由 PANJIT（强茂）生产的高性能肖特基二极管，主要针对需要低正向压降和快速开关速度的应用设计。这款二极管在最大正向电流可达 2A，并具有 40V 的反向耐压，适合在各种电子电路中使用。其典型的正向压降为 500mV@2A，这使得它在功耗和热管理方面具备了优越的表现。同时，SR24_R1_00001 也具有较低的反向漏电流，仅为 200uA@40V，确保在静态工作状态下的能量损耗最小化。
2. 封装及设计
SR24_R1_00001 采用 SMA(DO-214AC) 封装。这种封装形式不仅具有良好的热管理性能，还能够实现较高的电流承载能力，适合在紧凑的空间中使用。SMA 封装是 SMD(表面贴装) 组件中常见的一种，适合自动化生产线的安装，能够显著提升生产效率。其小巧的设计和标准的引脚间距也为 PCB 设计提供了灵活性，便于与其他元器件进行易于集成。
3. 应用领域
SR24_R1_00001 的设计使其非常适合用于多种电子应用，包括但不限于：
- 电源处理：肖特基二极管的低正向压降特性使其非常适合用于开关电源、降压转换器和buck变换器等电源管理电路中，能够提高系统的整体能效。
- 逆向连接保护：为避免逆向电流对电路的损害，SR24_R1_00001 可用于电源输入端的保护应用中，确保连接正确时电流可以正常流动，而在连接错误时反向电压被阻断。
- 整流电路：在适当的整流电路中，SR24_R1_00001 可作为输出整流二极管，提高转换效率，特别是在低电压和高频率的场合。
- LED驱动：在 LED 驱动电路中，肖特基二极管可用于防止 LED 反向工作，从而保护 LED 组件，延长其使用寿命。
4. 性能优势
SR24_R1_00001 相较于普通的硅二极管，具备显著的性能优势：
- 低正向压降：其 500mV 的正向压降大大低于常规硅二极管，能够有效减少功耗，提升系统效率。
- 快速恢复特性：肖特基二极管的快速恢复时间使其在高频开关应用中表现出色，减少开关损耗，提高系统的响应速度。
- 高可靠性：PANJIT 作为知名品牌，其产品经过严格质量控制，SR24_R1_00001 的高耐压与低漏电流特性，使得其在长期的工作状态下依然保持高性能，确保电路的稳定运行。
5. 结论
SR24_R1_00001 是一种高性价比、高可靠性的肖特基二极管，适应了现代电子电路对效率、稳定性和尺寸的多重需求。无论是在工业电源、消费电子、通讯设备还是其他高性能电路中，SR24_R1_00001 都能展现出其卓越的特性，是设计工程师在选型过程中值得考虑的优质元件。借助强茂的品牌实力，该元件在市场中已获得广泛应用与认可，成为电子产品设计中的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
