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PANJIT GS1004FL-AU_R1_000A1 GS1004FL
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT GS1004FL-AU_R1_000A1
- Type
- SOD-123FL
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- GS1004FL-AU_R1_000A1
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0227252342
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 1uA@400V
- (Vf)
- 1.1V@1A
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GS1004FL-AU_R1_000A1 产品概述
一、概述
GS1004FL-AU_R1_000A1 是 PANJIT（强茂）推出的一款通用整流二极管，采用独立式设计、SOD-123FL 表面贴装封装。该器件在 1A 工作电流下正向压降约为 1.1V，直流反向耐压达 400V，典型反向漏电流仅 1μA（在 400V 时测得）。凭借紧凑的封装与可靠的电气特性，适合多种中低功率开关电源、适配器与整流应用。
二、主要电气特性
- 正向压降（Vf）：1.1V @ If = 1A，低压降有助于减小导通损耗。
- 直流反向耐压（Vr）：400V，可满足 220VAC 整流与高压直流链路的耐压要求。
- 反向电流（Ir）：约 1μA @ Vr = 400V，低漏电流提高系统效率并降低静态功耗。
- 整流电流：1A（持续整流），适合中等电流级别的整流任务。
三、封装与物理特性
器件采用 SOD-123FL 封装，具有体积小、热阻较低、焊接可靠性高等优点，便于高密度 PCB 布局与自动贴装生产。独立式二极管形式便于在需要单点整流或替换的场合灵活使用。封装有利于减小寄生电感，适合开关频率较高的场合。
四、典型应用场景
- 开关电源（AC-DC）整流与输出整流
- 适配器、充电器整流与反向保护
- 家电与工业控制的高压直流整流
- 信号隔离、钳位与保护电路中的通用整流元件
五、使用建议与注意事项
- 整流电流 1A 时正向损耗约为 1.1W（P = Vf × If），长期使用请注意封板散热与环境温度，必要时对 PCB 铜箔进行加厚或增加散热面积。
- 反向漏电流随温度上升而增加，热环境下需评估漏电对系统静态功耗及安全性的影响。
- 峰值冲击电流（IFSM）及温度范围等更详细参数，请依赖官方资料与样片测试以确定极限条件，避免超出厂商规定的最大值。
- 推荐在回流焊工艺参数范围内进行焊接，遵循 PANJIT 的焊接与焊膏建议以保证焊点可靠性。
六、选型参考
GS1004FL-AU_R1_000A1 适用于对耐压、低漏电和中等导通损耗有要求的场合。如需更高电流或更低 Vf，可选用更大封装或肖特基型产品；如关注低正向压降以减少导通损耗，亦可考虑肖特基整流器，但需权衡耐压与漏电特性。选择时请结合系统最大工作电压、峰值电流、环境温度及热管理方案综合评估。
如需完整电气特性曲线、热阻、极限参数与封装尺寸图，请参考 PANJIT 官方数据手册或联系代理商获取样品与测试报告。
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