Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT SS14_R1_00101
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT SS14_R1_00101
- Type
- PANJIT
- Minimum package
- 1800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- SS14_R1_00101
- Electronic Component
- 1
- Package
- DO-214AC
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.099g
- Electronic Component
- 1
- Electronic Component
- BM0258712514
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 100uA@40V
- (Vf)
- 500mV@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 1800
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS14_R1_00101 产品概述
一、产品简介
SS14_R1_00101 为强茂（PANJIT）系列的表面贴装肖特基二极管，采用 DO-214AC（SMA）封装，面向中小功率整流与保护场合设计。器件具有较低的正向压降和快速恢复特性，适合要求低损耗、高效率的直流电路和开关电源前端整流应用。
二、主要参数
- 直流反向耐压 (Vr)：40 V
- 最大整流电流：1 A（连续）
- 反向电流 (Ir)：100 μA @ 40 V
- 非重复峰值浪涌电流 (Ifsm)：30 A（单次脉冲）
- 工作结温范围：-55 ℃ 至 +150 ℃
- 封装：DO-214AC（SMA）
该参数组合在保证连续工作能力的同时，对短时浪涌有良好承受力，适合消费电子和工业控制类设备中常见的负载冲击情形。
三、性能特点
- 低正向压降：肖特基结构使导通损耗低，有利于提高系统效率和降低发热。
- 低反向漏电：在额定反向电压下反向电流控制在较低水平，有助于降低静态功耗。
- 高温耐受：工作结温上限达 +150 ℃，在苛刻温度环境下仍能保持可靠工作。
- 抗浪涌能力：30 A 的单次峰值浪涌能力，可应对上电或短期过载产生的脉冲电流。
四、典型应用
- 开关电源及快恢复整流前端
- 反向保护与极性防护电路
- 续流（free-wheeling）二极管用于电机驱动与继电器驱动
- LED 驱动、电池管理与太阳能微型逆变器等要求低压降的场合
五、封装与热管理
DO-214AC 封装兼顾可焊性与散热性能，适合回流焊工艺。尽管肖特基二极管本体发热相对较小，但在高整流电流或高工作温度下仍需在 PCB 布局上考虑散热：增大焊盘面积、使用热铜过孔或连接到散热层，可显著降低结温并延长寿命。
六、可靠性与使用注意
- 焊接：建议遵循厂家回流曲线，避免过高温峰或长时间加热；多次回流需评估对器件性能的影响。
- ESD 与浪涌保护：在输入端配合适当的 TVS 或限流措施可提高系统可靠性。
- 存储：避免潮气与机械应力，未焊盘器件按常规 SMT 管理保存。
- 选型：在实际电路中应综合考虑最大工作电流、频率、温升与浪涌要求，必要时采用并联或选择更高规格器件以保证裕量。
综上，SS14_R1_00101 为一款适用范围广、性能均衡的 1A/40V 肖特基二极管，适合需要低压降与良好浪涌承受能力的中低功率电子应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
