WMSIC Electronic Components

PANJIT PDZ16B_R1_00001

ModelPDZ16B_R1_00001
PackageSOD-323
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT PDZ16B_R1_00001
Type
PANJIT
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
PDZ16B_R1_00001
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.018g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
20Ω
Electronic Component
BM0230815229
Diode
1
Current(Ir)
50nA@12V
Power Dissipation(Pd)
400mW
Electronic Component
15.85V~16.51V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PDZ16B_R1_00001 产品概述

一、产品简介

PDZ16B_R1_00001 为 PANJIT(强茂)出品的独立式稳压二极管,典型稳压值约 16V,适用于低功耗、精度要求中等的基准电压与过压保护场合。器件以 SOD-323 小型表贴封装提供,体积小、易于自动贴装,适合空间受限的消费类与工业电子产品。

二、主要参数

  • 稳压值(标称):16V
  • 稳压值范围:15.85V ~ 16.51V
  • 反向漏电流 Ir:50 nA @ 12V(低漏电)
  • 最大耗散功率 Pd:400 mW(在规定环境条件下)
  • 动态阻抗 Zzt:20 Ω
  • 脉冲/膝值阻抗 Zzk:80 Ω
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-323(表贴)

三、关键特性与优点

  • 低漏电流(50 nA@12V),适合对偏置电流敏感的电路。
  • 动态阻抗低(Zzt 20 Ω),在稳压点附近能提供较好的电压稳定性;Zzk 80 Ω 指示在变动或瞬态条件下的响应特性。
  • 400 mW 的耗散能力在 SOD-323 类小封装中属于常用等级,适合小功率稳压和保护用途。
  • 宽工作温度范围,满足工业级环境要求。

四、典型应用

  • 单端基准电压源与参考电路(需外接限流电阻)。
  • 过压/浪涌保护与钳位电路(低至中等能量脉冲)。
  • 偏置与电平移位电路,用于模拟与数模混合系统。
  • 便携与消费电子中的局部稳压,或作为保护元件用于接口电路。

五、封装与安装建议

  • SOD-323 小型封装适合自动贴装,建议按 PCB 布局预留标准焊盘并考虑热散逸路径。
  • 器件的最大 Pd 受环境温度与 PCB 散热条件影响明显,设计中应参照制造商热特性对功耗进行降额处理,避免长期在最大耗散条件下工作。
  • 焊接时请遵循 PANJIT 提供的回流温度曲线与手册要求,以保障焊接可靠性与器件性能。

六、使用与可靠性注意事项

  • 在使用稳压(二极管)构成参考源时,应选取合适的限流电阻和工作电流,避免超出 Pd 引起结温升高。
  • 高温或持续脉冲应进行热仿真与实测验证,保证结温远低于 150 ℃ 上限以延长寿命。
  • 对静电敏感元件,建议在生产与调试过程中采取 ESD 防护措施。
  • 具体极性识别与封装标识请参照产品数据手册。

七、采购与技术支持

PDZ16B_R1_00001 由 PANJIT(强茂)提供,适合需要小型化、低漏电与中等功率稳压需求的应用。采购与批量应用前建议索取并阅读完整数据手册,或联系供应商获取样片、器件测试曲线及回流焊工艺建议,以便在目标系统中进行可靠性验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.