Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT MB510_R2_00001
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT MB510_R2_00001
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- MB510_R2_00001
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.388g
- Electronic Component
- 1
- Electronic Component
- BM0264241001
- Current
- 5A
- Diode
- 1
- (Vf)
- 900mV@5A
- Electronic Component
- 65℃~+175℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 100V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB510_R2_00001 产品概述
一、产品简介
MB510_R2_00001 为强茂（PANJIT）生产的一颗独立式肖特基整流二极管，封装为 SMC（DO-214AB）。该器件为低正向压降、高可靠性的功率肖特基，适合高速整流与功率管理场合。典型应用包括开关电源整流、续流二极管、反向电池保护与各种 DC-DC 转换器。
二、主要参数
- 二极管配置：1 个独立式
- 正向压降（Vf）：0.9 V @ IF = 5 A
- 直流反向耐压（Vr）：100 V
- 额定整流电流（IF(AV)）：5 A
- 工作结温范围：-65 ℃ ～ +175 ℃
- 非重复峰值浪涌电流（Ifsm）：100 A（典型为 8.3 ms 半波浪涌条件）
- 封装：SMC（表面贴装，大功率散热尺寸）
- 类型：肖特基二极管（Schottky）
三、产品特点
- 低正向压降，降低整流损耗、改善系统效率（5 A 时 Vf ≈ 0.9 V）。
- 高耐压 100 V，适用于中高压功率场合。
- 高温工作能力，结温最高可达 175 ℃，提高系统可靠性与寿命裕度。
- 良好浪涌承受能力，非重复峰值浪涌 100 A，适合启动及短时冲击负载。
- SMC 封装便于手工焊接与回流工艺，并提供良好热阻与 PCB 散热面接触面积。
四、典型应用场景
- 开关电源（AC-DC 与 DC-DC）整流输出。
- 电机驱动与逆变器中的续流/回流二极管。
- 电池充放电与反向保护电路。
- 车载电源与工业电源（注意系统瞬态与抑制需求）。
- 各类功率模块与电源管理单元中的整流与保护元件。
五、设计与使用建议
- 连续工作电流应按环境温度与 PCB 散热能力进行降额，确保结温低于器件最大额定温度。推荐在 5 A 额定电流附近做好热仰角（thermal pad）与铜箔散热设计。
- 在存在大浪涌或频繁启动场合，关注 Ifsm 限值与实际波形（常以 8.3 ms 半波为准），必要时并联或选用更高浪涌能力器件。
- 由于肖特基结构在高温下漏电流增长显著，热设计与散热路径非常重要；在高温环境下应考虑额定电流降额或增加散热面积。
- 焊接工艺建议采用标准无铅回流曲线，避免长时间高温暴露；通过手册给出的回流峰值温度与时长进行工艺验证。
- 为保证长期可靠性，推荐在系统设计中预留反向电压裕量，避免长时间接近最大 Vr 条件工作。
六、包装与采购提示
- 封装为 SMC，适配常用功率型贴片生产线与回流焊工艺。
- 采购时请标注完整料号（MB510_R2_00001）与品牌（PANJIT / 强茂），并参考强茂官方数据手册获取详细的电气特性曲线、封装尺寸与回流工艺参数。
- 如需批量应用于汽车或高可靠场景，建议与厂商确认批次、可靠性测试报告与可追溯性资料。
结语：MB510_R2_00001 以其低正向压降、100 V 耐压与良好热特性，适合多种中高功率整流与保护应用。合理的热设计与浪涌评估可确保器件在系统中的长期稳定运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
