WMSIC Electronic Components

PANJIT BZX84C3V3_R1_00001

ModelBZX84C3V3_R1_00001
PackageSOT-23
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT BZX84C3V3_R1_00001
Type
PANJIT
Minimum package
3000

Technical parameters

Electronic Component
PANJIT
Electronic Component
BZX84C3V3_R1_00001
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
95Ω
Electronic Component
BM0265817259
Diode
1
Current(Ir)
5uA@1V
Power Dissipation(Pd)
410mW
Electronic Component
3.14V~3.47V
Electronic Component
55℃~+150℃
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C3V3_R1_00001 产品概述

BZX84C3V3_R1_00001 是强茂(PANJIT)生产的一款独立式小信号稳压二极管,采用 SOT-23 封装,标称稳压值 3.3V。该器件针对低功耗、小体积电路中的基准稳压与过压保护而设计,具有宽温度工作范围和良好的稳压特性,适合便携设备、传感器接口与电源辅助稳压场合。

一、主要参数概览

  • 器件型号:BZX84C3V3_R1_00001(PANJIT)
  • 封装:SOT-23(小体积/表贴)
  • 标称稳压:3.3V
  • 稳压值范围:3.14V ~ 3.47V
  • 反向漏电流 Ir:5 µA @ VR = 1.0V
  • 耗散功率 Pd:410 mW(典型额定耗散,实际使用需按温升进行降额)
  • 动态阻抗 Zzt:95 Ω(在规定测试电流下)
  • 交流小信号阻抗 Zzk:600 Ω(在低电流区)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 配置形式:独立式稳压二极管(单个器件实现稳压/钳位功能)

二、器件特性与性能要点

  • 小封装、高集成:SOT-23 封装便于面板贴装和高密度布局,适合空间受限的应用。
  • 稳压精度:稳压值范围 3.14V–3.47V,适用于对基准电压有中等精度要求的场合。
  • 低反向电流:在 VR = 1.0V 时 Ir 仅 5 µA,有利于在微弱偏置下保持低功耗和小的泄漏影响。
  • 动态阻抗与转折特性:较低的 Zzt 表明在规定测试电流下具有较好的稳压能力;较高的 Zzk 指示在低电流区域有明显的非线性特性,设计时需注意工作电流范围对稳压点的影响。
  • 宽工作温度:-55 ℃ 到 +150 ℃ 的结温范围,适应工业级温区要求。

三、应用场景

  • 低功耗线性基准与参考电压源(配合限流电阻使用)
  • 小型便携式电源的辅助稳压与钳位
  • 模拟/混合信号电路中的基准与参考点
  • 串联保护和过压钳位(瞬态能量较小时)
  • 传感器前端电路、接口电平移位与保护

四、设计与使用建议

  • 限流设计:稳压二极管通常以钳位/分流方式工作,需要串联限流电阻以限制流过二极管的电流,避免超过 Pd 引起过热。
  • 功率降额:Pd 为 410 mW,但在实际 PCB 上受焊盘、铜箔面积和环境温度影响较大。长时间工作时建议按温度升高进行降额使用,或采用适当的散热铜箔布局。
  • 工作电流选择:为了获得较稳定的稳压点,应选择使二极管工作在其额定测试电流附近的偏流区;在极低电流下(接近 Ir),稳压点可能偏离标称值。
  • 布局注意:SOT-23 引脚间距小,贴装时保证焊盘尺寸符合厂商推荐,必要时在二极管附近增加散热铜箔以改善热迁移。
  • 环境与可靠性:工作结温允许到 +150 ℃,但器件寿命与长期可靠性在高温高功耗条件下会降低,建议遵循温升控制原则。

五、包装与选型建议

  • 选型时请根据实际电路工作电流、允许功耗与温度条件评估是否需要更大功率的稳压器或使用并联/热管理手段。
  • 对于对稳压精度有更高要求的场合,可考虑配合低温漂精密参考源或采用温度补偿设计。
  • 购买与生产时,请确认所购器件为 PANJIT 正品,并参照官方数据表获取详细电气特性、测试条件和焊接规范。

BZX84C3V3_R1_00001 提供了一种在受限空间与中低功耗环境下实现稳压与过压保护的经济方案,适合多种消费电子、工业控制与传感类应用。若需更详细的电气特性曲线或封装机械图,请参考强茂官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.