WMSIC Electronic Components

PANJIT US1K_R1_00001

ModelUS1K_R1_00001
PackageSMA(DO-214AC)
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT US1K_R1_00001
Type
PANJIT
Minimum package
1800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
US1K_R1_00001
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.118g
Electronic Component
1
Electronic Component
BM0227686031
Current
1A
Diode
1
Current(Ir)
1uA@800V
(Vf)
1.7V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

US1K_R1_00001 产品概述

一、简介

US1K_R1_00001 是强茂(PANJIT)推出的一款独立式快恢复/高效率二极管,封装为 SMA (DO-214AC)。该器件面向高压开关和整流场合,具有800V的反向耐压能力、1A的整流电流等级以及较低的反向漏电和中等恢复时间,适合交流-直流转换、PFC、逆变器和电源保护等应用。

二、主要参数

  • 二极管配置:独立式
  • 正向压降(Vf):1.7V @ If = 1A
  • 直流反向耐压(Vr):800V
  • 最大整流电流:1A(直流)
  • 反向电流(Ir):1 μA @ Vr = 800V
  • 反向恢复时间(Trr):100 ns
  • 工作结温范围(Tj):-55℃ ~ +150℃
  • 封装:SMA (DO-214AC)
    注:详尽的电气/热特性、浪涌能力及频率相关损耗,请参见厂商数据手册。

三、产品特点

  • 高电压耐受:800V 反向耐压,适合中高压整流与开关环境。
  • 低反向漏电:在Vr=800V 时 Ir 典型为 1 μA,有利于提高空载效率与降低待机损耗。
  • 快恢复特性:Trr≈100 ns,比普通慢恢复二极管损耗与开关交越时间更小,适配较高开关频率的电源拓扑。
  • 可靠封装:SMA/DO-214AC 封装便于自动贴装与回流焊,兼顾散热与体积。

四、典型应用场景

  • 开关电源(SMPS)高压整流与续流;
  • 功率因数校正(PFC)电路高压侧整流;
  • 逆变器/变频器的自由轮回与钳位电路;
  • 电源适配器、电视、电源板及工业电源等需要800V耐压的场合。

五、封装与安装建议

  • 封装为 SMA (DO-214AC),焊接采用常规回流工艺;焊接温度与时间应遵循强茂推荐回流曲线以保证可靠性。
  • PCB 布局建议:整流/续流路径尽量短且宽,减少寄生电感;必要时在焊盘附近增加散热铜箔或通孔散热。
  • 极性识别:器件表面有极性标记,注意放置方向以免倒装。

六、可靠性与应用注意

  • 虽然器件最高结温可达 +150℃,但长期可靠性通常要求在制造商推荐的结温范围内工作,并在高温下按厂方的降额曲线使用。
  • 在高频开关场合,考虑反向恢复引起的瞬态应力和电磁干扰,必要时配合 RC 浪涌吸收或软恢复拓扑。
  • 对于关键设计,请参考强茂完整数据手册中的热阻、浪涌电流能力和典型特性曲线来做热与电气降额设计。

七、采购与替代

  • 品牌:PANJIT(强茂);型号:US1K_R1_00001;封装:SMA。
  • 若需更低正向压降或更短恢复时间,可考虑 Schottky(二极管)或超快恢复(UFR)系列,但需注意电压等级与漏电差异。
  • 采购时建议索取原厂数据手册与样品进行电路验证。

如需我帮您核对具体电气曲线、热阻或与现有电路的兼容性评估,请提供电路工作条件(最大电流、开关频率、环境温度等)。

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