WMSIC Electronic Components

PANJIT MMSZ5231B_R1_00001

ModelMMSZ5231B_R1_00001
PackageSOD-123
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT MMSZ5231B_R1_00001
Type
PANJIT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
MMSZ5231B_R1_00001
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzk)
1.6kΩ
(Zzt)
17Ω
Electronic Component
BM0227277543
Diode
1
Current(Ir)
5uA@2V
Power Dissipation(Pd)
500mW
Electronic Component
4.85V~5.36V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ5231B_R1_00001 产品概述

1. 产品简介

MMSZ5231B_R1_00001 是一款由 PANJIT(强茂)公司生产的稳压二极管,采用独立式配置,封装形式为 SOD-123。该稳压二极管的主要功能是在电路中提供稳定的电压输出,广泛应用于各种电子设备中,如电源管理、信号处理和保护电路等。

2. 关键参数

  • 功率 (Pd): 500mW
    该稳压二极管的最大功耗为500毫瓦,适用于低功耗应用场景。

  • 反向电流 (Ir): 5μA @ 2V
    在反向电压为2V时,反向电流仅为5微安,表现出优异的反向截止特性。

  • 稳压值 (标称值): 5.1V
    该稳压二极管的标称稳压值为5.1V,适用于需要5V左右稳定电压的电路。

  • 稳压值 (范围): 4.85V ~ 5.36V
    实际稳压值在4.85V至5.36V之间,确保在不同工作条件下仍能提供稳定的电压输出。

  • 阻抗 (Zzt): 17Ω
    动态阻抗为17欧姆,表示在稳压区域内电压随电流变化的敏感度较低。

3. 产品特点

  • 高稳定性: 稳压值范围窄,确保在不同工作条件下输出电压的稳定性。
  • 低反向电流: 反向电流极低,减少功耗并提高电路效率。
  • 小封装: 采用SOD-123封装,体积小巧,适合高密度PCB布局。
  • 广泛适用性: 适用于多种电子设备,如电源管理、信号处理和保护电路等。

4. 应用领域

  • 电源管理: 用于稳压电源模块,确保输出电压的稳定性。
  • 信号处理: 在信号处理电路中提供稳定的参考电压。
  • 保护电路: 用于过压保护电路,防止敏感元件因电压过高而损坏。
  • 消费电子: 广泛应用于手机、平板电脑、数码相机等消费电子产品中。

5. 封装信息

  • 封装类型: SOD-123
    SOD-123是一种表面贴装封装,尺寸小巧,适合高密度PCB布局。其尺寸为2.5mm x 1.3mm x 1.0mm,便于自动化生产。

6. 品牌介绍

  • 品牌: PANJIT(强茂)
    PANJIT 是一家知名的半导体制造商,专注于二极管、晶体管、稳压二极管等元器件的研发和生产。其产品以高质量、高可靠性和广泛的应用领域而著称。

7. 使用注意事项

  • 工作温度: 确保在规定的温度范围内使用,避免过热导致性能下降或损坏。
  • 焊接条件: 遵循推荐的焊接条件,避免因焊接不当导致封装损坏或性能下降。
  • 静电防护: 在处理和安装过程中,采取适当的静电防护措施,防止静电放电损坏器件。

8. 结论

MMSZ5231B_R1_00001 是一款高性能的稳压二极管,具有高稳定性、低反向电流和小封装等特点,适用于多种电子设备中的电源管理、信号处理和保护电路等应用。其优异的性能和广泛的应用领域使其成为电子设计工程师的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.