WMSIC Electronic Components

PANJIT GDZJ18C_AY_10001

ModelGDZJ18C_AY_10001
PackageDO-34
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT GDZJ18C_AY_10001
Type
PANJIT
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
GDZJ18C_AY_10001
Electronic Component
1
Package
DO-34
Electronic Component
Zener Diode
Electronic Component
0.1g
Electronic Component
1
(Zzk)
150Ω
(Zzt)
45Ω
Electronic Component
BM0264795511
Diode
1
Current(Ir)
200nA@13V
Power Dissipation(Pd)
500mW
Electronic Component
17.42V~18.33V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GDZJ18C_AY_10001 产品概述

一、主要特性

GDZJ18C_AY_10001 是强茂(PANJIT)推出的一款 18V 额定稳压二极管,采用平面芯片结构与 DO-34(轴向)封装,单只独立器件设计。器件具有低反向漏流、较小的稳压阻抗和 500mW 的中等耗散能力,适合低功耗稳压与参考电路。产品为无铅、符合欧盟 RoHS 2.0 要求,便于自动化组装与量产应用。

二、典型电气参数

  • 标称稳压值:18V(典型范围 17.42V ~ 18.33V)
  • 反向电流 Ir:≤200nA(在 13V 条件下测得)
  • 动态阻抗 Zzt:45Ω
  • 曲线阻抗 Zzk:150Ω
  • 最大耗散功率 Pd:500mW(环境与散热条件影响实际可用功率)
    说明:在理想散热条件下,最大直流稳压电流 Iz ≈ Pd / Vz ≈ 0.5W / 18V ≈ 27.8mA;实际电流应结合温度降额与电路需求调整。

三、机械与封装

封装为 DO-34 轴向玻璃/金属外壳,适合自动化插装与波峰焊或手工焊接流程。平面芯片结构有助于稳定的电气特性与良好的热传导。单只器件的形式便于在有限空间内实现点对点稳压或参考电路设计。

四、热性能与可靠性

器件设计强调长期稳定性与低噪声特性,但 500mW 的耗散限制其在高温环境或无良好散热条件下的使用电流。建议根据制造商的功耗-温度曲线进行温度降额设计,避免长期接近 Pd 极限,以延长寿命并保持稳压精度。

五、典型应用

  • 低功耗电源的参考与稳压(例如传感器前端、便携设备)
  • 仪表与测量电路中的基准电压源
  • 流程控制、小型电源保护与电压监测电路
    注意:不建议用于高功率或需要大浪涌承受能力的场合。

六、装配与使用注意事项

  • 按制造商推荐的焊接温度与时长进行装配,避免过热损伤芯片与封装。
  • 在设计时留出足够的热散面积,并为长期工作环境做降额设计。
  • 工作时注意限制稳压电流,避免在 Pd 限值附近长期工作。
  • 储存与搬运遵循常规静电防护与湿敏防护要求。

七、采购与质量保证

该器件出自 PANJIT(强茂),为符合 RoHS 的无铅产品,适合电子制造业标准化量产。订购时请确认完整型号 GDZJ18C_AY_10001、封装与出货形式,并向供应商索取最新数据手册以获得详尽的测试条件与典型曲线支持。

总结:GDZJ18C_AY_10001 以其 18V 稳压点、低漏流与适中的功耗等级,适合各类对精度、稳定性与可装配性有要求的低功耗稳压应用。对于具体电路设计,建议参考厂家完整规格书并进行热与电流降额验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.