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PANJIT SBA120CS_R1_00001
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT SBA120CS_R1_00001
- Type
- PANJIT
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- SBA120CS_R1_00001
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Electronic Component
- BM0227309741
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 100uA@20V
- (Vf)
- 450mV@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SBA120CS_R1_00001 产品概述
一、产品简介
SBA120CS_R1_00001 是强茂（PANJIT）推出的一款小封装肖特基整流二极管，额定连续正向电流为 1A，直流反向耐压 20V，封装为 SOD-323。该器件以低正向压降和快恢复特性为主要优势，适合对效率和开关损耗敏感的低电压电源与保护电路。
二、主要电气参数
- 工作结温范围：-55℃ ~ +150℃
- 正向压降 Vf：450mV @ 1A（典型值）
- 非重复峰值浪涌电流 Ifsm：8A（单次浪涌）
- 直流反向耐压 Vr：20V
- 反向电流 Ir：100μA @ 20V（通常测量于室温）
- 连续正向电流 If：1A
- 品牌：PANJIT（强茂）
- 封装：SOD-323
三、性能特点与优势
- 低正向压降：450mV@1A 的 Vf 有助于降低整流或电源开关中的功耗，提高系统效率。
- 小型封装：SOD-323 占板面积小，适合高密度 SMT 布局与空间受限场合。
- 抗浪涌能力：8A 的非重复峰值浪涌电流可承受瞬态冲击，适用于启动或突发负载情况。
- 宽温工作：-55℃ 至 +150℃ 的结温范围，适应工业级环境。
四、典型应用场景
- 便携式及电池供电设备的电源整流与续流保护
- 电源管理模块（降压/升压转换器）的输出整流
- 电池和电源路径保护（反向连接保护、OR-ing）
- 快速开关电路、保护钳位与小信号整流场合
五、封装与布局建议
- 虽然 SOD-323 为小型封装，但热阻相对较高，建议在 PCB 上安排较大铜箔区域作为散热岛，并尽量采用短、宽的焊盘与引线走线以降低温升。
- 在高频或脉冲应用中，尽量缩短连接电感，放置旁路电容以抑制寄生振荡。
- 对于需要更好散热的应用，可在焊盘下方或周围布置若干散热过孔（接地或电源层），以辅助热流传导。
六、使用与可靠性注意事项
- 反向漏电 Ir 会随结温上升显著增加，设计时需考虑高温下的漏电容忍度与功耗。
- Ifsm 为非重复峰值参数，不应作为频繁冲击或恒定冲击的长期规格使用；若应用中存在反复浪涌，应选用更大冲击能力的器件或并联/改进保护方案。
- 遵循标准 SMT 回流焊曲线与 ESD 防护措施，避免超过器件的最高结温与热冲击。
- 在长期高温或高电流场合，应对器件进行热仿真与实测验证，必要时进行电流降额。
七、结论
SBA120CS_R1_00001 以其低正向压降、紧凑封装和工业级温度范围，适合于多类低压整流与保护应用。设计时需重视封装的热管理和反向漏电随温度上升的特性，通过合理的 PCB 布局与热设计，可在空间受限的设备中实现可靠且高效的整流与保护功能。
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