WMSIC Electronic Components

PANJIT SBA120CS_R1_00001

ModelSBA120CS_R1_00001
PackageSOD-323
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT SBA120CS_R1_00001
Type
PANJIT
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
SBA120CS_R1_00001
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.019g
Electronic Component
1
Electronic Component
BM0266030380
Current
1A
Diode
1
Current(Ir)
100uA@20V
(Vf)
450mV@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SBA120CS_R1_00001 产品概述

一、产品简介

SBA120CS_R1_00001 是强茂(PANJIT)推出的一款小封装肖特基整流二极管,额定连续正向电流为 1A,直流反向耐压 20V,封装为 SOD-323。该器件以低正向压降和快恢复特性为主要优势,适合对效率和开关损耗敏感的低电压电源与保护电路。

二、主要电气参数

  • 工作结温范围:-55℃ ~ +150℃
  • 正向压降 Vf:450mV @ 1A(典型值)
  • 非重复峰值浪涌电流 Ifsm:8A(单次浪涌)
  • 直流反向耐压 Vr:20V
  • 反向电流 Ir:100μA @ 20V(通常测量于室温)
  • 连续正向电流 If:1A
  • 品牌:PANJIT(强茂)
  • 封装:SOD-323

三、性能特点与优势

  • 低正向压降:450mV@1A 的 Vf 有助于降低整流或电源开关中的功耗,提高系统效率。
  • 小型封装:SOD-323 占板面积小,适合高密度 SMT 布局与空间受限场合。
  • 抗浪涌能力:8A 的非重复峰值浪涌电流可承受瞬态冲击,适用于启动或突发负载情况。
  • 宽温工作:-55℃ 至 +150℃ 的结温范围,适应工业级环境。

四、典型应用场景

  • 便携式及电池供电设备的电源整流与续流保护
  • 电源管理模块(降压/升压转换器)的输出整流
  • 电池和电源路径保护(反向连接保护、OR-ing)
  • 快速开关电路、保护钳位与小信号整流场合

五、封装与布局建议

  • 虽然 SOD-323 为小型封装,但热阻相对较高,建议在 PCB 上安排较大铜箔区域作为散热岛,并尽量采用短、宽的焊盘与引线走线以降低温升。
  • 在高频或脉冲应用中,尽量缩短连接电感,放置旁路电容以抑制寄生振荡。
  • 对于需要更好散热的应用,可在焊盘下方或周围布置若干散热过孔(接地或电源层),以辅助热流传导。

六、使用与可靠性注意事项

  • 反向漏电 Ir 会随结温上升显著增加,设计时需考虑高温下的漏电容忍度与功耗。
  • Ifsm 为非重复峰值参数,不应作为频繁冲击或恒定冲击的长期规格使用;若应用中存在反复浪涌,应选用更大冲击能力的器件或并联/改进保护方案。
  • 遵循标准 SMT 回流焊曲线与 ESD 防护措施,避免超过器件的最高结温与热冲击。
  • 在长期高温或高电流场合,应对器件进行热仿真与实测验证,必要时进行电流降额。

七、结论

SBA120CS_R1_00001 以其低正向压降、紧凑封装和工业级温度范围,适合于多类低压整流与保护应用。设计时需重视封装的热管理和反向漏电随温度上升的特性,通过合理的 PCB 布局与热设计,可在空间受限的设备中实现可靠且高效的整流与保护功能。

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