Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT SS1040HEWS_R1_00001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT SS1040HEWS_R1_00001
- Type
- PANJIT
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- SS1040HEWS_R1_00001
- Electronic Component
- 1
- Package
- SOD-323HE
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.02g
- Electronic Component
- 1
- Electronic Component
- BM69415409
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 100uA@40V
- (Vf)
- 580mV@1A
- Electronic Component
- 40℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SS1040HEWS_R1_00001
产品简介
SS1040HEWS_R1_00001是一款高性能肖特基二极管，具有580mV的正向压降（VF）在1A的工作电流下。该元件由知名品牌PANJIT（强茂）制造，采用SOD-323HE封装，设计旨在提高电子设备的效率和可靠性。凭借其优秀的电气特性和灵活的封装形式，SS1040HEWS_R1_00001特别适合于便携式电子设备、电源管理和高频应用，满足现代电子技术日益增长的需求。
主要特性
- 正向压降：580mV（1A）
- 反向击穿电压：40V
- 反向漏电流：100μA（在40V下）
- 最大电流：1A
- 封装类型：SOD-323HE
电气特性
SS1040HEWS_R1_00001展现出优异的电气性能，其正向压降在1A下仅为580mV，这意味着在为负载供电时产生的热量极小，从而提高系统的整体能效。这种特性特别适合用于低功耗应用，能够有效延长电池寿命，尤其在手机、平板电脑及其他移动设备中。
其设计中的40V反向击穿电压使之可以应对多种操作环境，这使得SS1040HEWS_R1_00001成为的理想选择用于需要高电压稳定性的应用场景。此外，100μA的反向漏电流在40V时体现了该元件在静态时的极低功耗，进一步增强了其在电源管理系统中的应用价值。
封装特点
SOD-323HE封装具有小尺寸和轻量化的特点，非常适合现代电子设备的微型化趋势。这种封装在PCB设计中方便布局，节省空间，并提升了电路的整体可靠性。SOD-323HE封装能够支持自动贴装，减少制造过程中的人力成本和工时，提高生产效率。
应用领域
SS1040HEWS_R1_00001广泛应用于多个领域，包括但不限于：
- 便携式设备：如智能手机、平板电脑和笔记本电脑等，需要高效能和高稳定性的电源管理系统。
- 消费电子产品：各种家用电器和新型电子产品中，作为电源整流或保护二极管使用。
- 电源管理：用于电源转换器、DC-DC变换器等产品中，提高转换效率与降低功耗。
- 汽车电子：在车载电源模块中，提供高效能的电流整流和保护方案，以满足汽车电子设备对可靠性和稳定性的严苛要求。
总结
SS1040HEWS_R1_00001是PANJIT（强茂）推出的一款性能优异的肖特基二极管，具备580mV@1A的低正向压降、40V的高反向击穿电压以及静态漏电流仅为100μA的显著优势。这些特性使其成为电源管理、电动设备及其他高效能应用中极具竞争力的选择。凭借SOD-323HE小巧的封装形式，SS1040HEWS_R1_00001不仅满足了现代设备对空间和效率的双重需求，也为设计师提供了更多的灵活性和便利。选择该产品，将为您的设计改进整体性能，提升设备可靠性，推动技术创新的进程。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
