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PANJIT SR24_R2_001A1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT SR24_R2_001A1
- Type
- PANJIT
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- SR24_R2_001A1
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.123g
- Electronic Component
- 1
- Electronic Component
- BM0263665349
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 220uA@40V
- (Vf)
- 500mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SR24_R2_001A1 产品概述
一、产品简介
SR24_R2_001A1 是 PANJIT（强茂）推出的单个独立封装二极管，采用 SMA 表面贴装封装，面向中等功率整流与保护场景。器件在典型工作点 2A 时正向压降为 0.5V，反向耐压 40V，短时浪涌能力达到 50A，适合用于开关电源整流、适配器、车载电子及一般功率保护电路。
二、主要电气参数
- 正向压降 Vf：0.5V @ 2A（低压降利于降低导通损耗）
- 连续整流电流 If：2A（引脚和封装限制的连续工作电流）
- 直流反向耐压 Vr：40V（适合低压直流系统）
- 反向电流 Ir：220µA @ 40V（在常温下反向漏流较小）
- 非重复峰值浪涌电流 Ifsm：50A（用于吸收短时浪涌和浪涌电流）
- 工作结温范围：-55°C ~ +150°C（宽温度范围，适合工业级应用）
注：若需在不同温度或脉冲条件下使用，请参考完整器件数据手册以获取测试条件和曲线图。
三、热特性与散热建议
在额定 2A 工作点下，器件功耗约为 P = Vf × I ≈ 0.5V × 2A = 1.0W。SMA 封装受限于较小的散热面积，建议在 PCB 设计时采取以下措施：
- 在焊盘下和周围加大铜箔面积（多层板时连接大地平或散热层），以降低结-壳和结-周围温升；
- 对于连续高平均功率应用，应增加过孔或热通道将热量传导至内层或底层散热铜箔；
- 考虑在高环境温度下进行电流降额，保证器件结温低于额定上限 150°C；
- 对于频繁冲击或长脉冲浪涌，评估 Ifsm 在特定波形（如 8.3ms 半正弦）下的允许值并留有安全裕度。
四、封装与生产适配
SMA 表面贴装封装体积小、适合高速贴片生产，适用于自动化回流焊工艺。焊接时应遵循制造商推荐的回流温度曲线与焊盘尺寸，以保障焊接可靠性与热导性。为提高可靠性，建议在工业级环境下选用受控湿度存储和按需焊接。
五、典型应用场景
- AC/DC 和 DC/DC 电源的整流与续流二极管；
- 适配器、充电器及车载 12V/24V 低压系统的整流与浪涌保护；
- 反向电压保护、极性保护电路；
- LED 驱动器、电机驱动器中的保护与吸收功能。
六、可靠性与选型注意事项
- 反向漏电流 Ir 随温度上升会显著增加，高温环境下应验证实际漏流是否满足系统需求；
- 如果应用中存在频繁或较长脉冲浪涌，务必参照完整数据手册确认 Ifsm 的波形与脉冲长度条件；
- 在设计中留有热裕度和电流降额策略，避免长期在极限参数下工作以延长寿命；
- 如需更低正向压降或更高反向耐压的替代件，可与 PANJIT 产品族相关型号比较选择。
结语：SR24_R2_001A1 以低正向压降、适中的连续电流与较强的瞬态浪涌能力，在中低压整流与保护场合表现平衡。最终应用前建议结合完整数据手册、实际温度与 PCB 布局进行热与电的验证。
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