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PANJIT BAV99_R1_00101
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT BAV99_R1_00101
- Type
- PANJIT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- BAV99_R1_00101
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0258712507
- Current
- 150mA
- Diode
- 1
- Current(Ir)
- 2.5uA@75V
- (Vf)
- 1V@10mA
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- 55℃~+125℃@(Tj)
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV99_R1_00101 产品概述
一、器件简介
BAV99_R1_00101 是强茂（PANJIT）出品的一款小信号开关二极管，采用 SOT-23 封装、内部为一对串联式二极管。该器件面向高频开关与信号整形应用，具有低正向压降和快速恢复特性，适合体积受限的印制板设计与表面贴装工艺。
二、主要电气参数
- 正向压降 Vf：1.0 V @ 10 mA（串联二极管）
- 直流反向耐压 Vr：75 V
- 最大整流电流 If（连续）：150 mA
- 峰值非重复浪涌电流 Ifsm：4 A
- 耗散功率 Pd：250 mW
- 反向电流 Ir：2.5 μA @ 75 V
- 反向恢复时间 Trr：4 ns
- 工作结温范围 Tj：-55 ℃ ～ +125 ℃
三、主要特点与优势
- 低正向压降：10 mA 条件下约 1 V，有利于降低信号损耗与电平偏移。
- 快速恢复：Trr ≈ 4 ns，适合高频开关与脉冲信号处理。
- 宽耐压与低泄漏：75 V 反向耐压与微安级反向电流，便于在中低电压系统中做电平隔离或钳位。
- 小型封装：SOT-23 适合高密度 PCB 布局与自动化贴装。
四、典型应用场景
- 高速信号开关、二极管开关阵列、门限整形。
- 输入保护、夹位与反向保护电路（非主电源整流）。
- 混频、检波与射频前端的倾向性开关（低功率）。
- 电平移位与逻辑接口中作抽头/钳位元件。
五、封装与工艺建议
- SOT-23 小巧，但 Pd 仅 250 mW，建议在 PCB 布局时为器件周围留出铜皮以帮助散热，并避免长时间高电流工作。
- 器件适用于常规 SMD 回流焊流程，具体回流温度曲线与湿敏等级请参照厂商资料。
- 装配和调试时注意静电防护（ESD），以免损伤结电容或击穿结。
六、选型与使用注意
- 若电路中存在持续大电流或较大功率耗散，应选用额定电流和耗散能力更高的器件；BAV99_R1_00101 更适合信号级或小电流开关场合。
- 正向压降随电流增大而上升，设计时应考虑 Vf 对电平或增益的影响。
- 在较高环境温度下，反向泄漏电流会增加，长期工作请参考厂商温度相关曲线并做余量设计。
- 非重复峰值浪涌 4 A 仅用于短时冲击，切勿用于持续浪涌工况。
总结：BAV99_R1_00101 以其低 Vf、快速恢复与小巧 SOT-23 封装，适合用于高频、小信号开关、保护与电平处理场合。在实际应用中应关注热管理与电流/电压边界，必要时参考强茂官方数据手册以获得完整的电气和热特性曲线。
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