WMSIC Electronic Components

PANJIT SS1020FL_R1_00001

ModelSS1020FL_R1_00001
PackageSOD-123FL
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT SS1020FL_R1_00001
Type
PANJIT
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
SS1020FL_R1_00001
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.024g
Electronic Component
1
Electronic Component
BM0264887149
Current
1A
Diode
1
Current(Ir)
30uA@20V
(Vf)
550mV@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS1020FL_R1_00001 产品概述

一、产品简介与定位

SS1020FL_R1_00001 是强茂(PANJIT)出品的一款独立式肖特基整流二极管,封装为 SOD-123FL,面向对快速开关、低正向压降和小体积封装有需求的消费电子与功率管理应用。器件典型正向压降为 0.55V(IF = 1A),额定整流电流 1A,直流反向耐压 20V,反向漏电流 30µA(VR = 20V),结温范围 -55℃ 至 +150℃。

二、主要电气参数

  • 正向压降 (Vf):0.55V @ IF = 1A(典型)
  • 最大整流电流:1A(DC)
  • 直流反向耐压 (Vr):20V
  • 反向电流 (Ir):30µA @ VR = 20V
  • 工作结温:-55℃ ~ +150℃
  • 封装:SOD-123FL,独立式单颗二极管

三、关键特性与优点

  • 低正向压降:在 1A 工作点上 Vf≈0.55V,有助于降低整流功耗和发热,提升效率。
  • 快速响应:肖特基结构提供较短的恢复时间,适合开关电源与高频整流。
  • 低漏电流:在 20V 反向下 Ir≈30µA,适合电池供电及待机功耗敏感的场合。
  • 宽温度范围与良好可靠性:可在严苛环境下长期工作,适合工业与车载低压子系统(需验证车规要求)。

四、典型应用场景

  • 开关电源次级整流与二次侧保护
  • 电源轨反向防护、极性保护与电池充放电路径保护
  • 高频整流、钳位与自由轮回二极管
  • 便携与消费类电子:移动电源、充电器、便携设备电源管理

五、封装与装配建议

  • SOD-123FL 为表面贴装低轮廓封装,便于自动贴片与回流焊工艺。建议采用标准回流温度曲线,避免超出封装热极限。
  • PCB 布局建议:器件散热依赖铜箔面积,建议将阴极/阳极焊盘拓宽并在铜箔下布置散热平面或通孔以增强散热能力;在高电流应用下注意焊盘与接地/电源层的热阻。
  • 热管理与降额:在高环境温下需对额定电流进行降额处理,检测实际结温并留有余量以确保长期可靠性。

六、可靠性与选型注意事项

  • 反向漏流随温度上升显著增加,热敏感应用应评估在最高工作温度下的漏电表现。
  • 若应用电压接近 20V,应考虑电压裕量或选用更高 Vr 的器件以提升安全裕度。
  • 在需更高电流或更低 Vf 的场合,可并联多只器件但需注意电流均分与热均衡。

七、订购信息

  • 型号:SS1020FL_R1_00001
  • 品牌:PANJIT(强茂)
  • 封装:SOD-123FL
  • 包装与供货:以卷盘或散装为主(具体请参考强茂产品数据手册或向供应商确认)

如需完整的电气特性曲线、典型等温性能数据、封装尺寸图或推荐 PCB 封装,请提供联系方式或告知是否需要我帮您检索并整理数据表内容。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.