WMSIC Electronic Components

PANJIT UF3010GP_AY_00001

ModelUF3010GP_AY_00001
PackageDO-201AD
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT UF3010GP_AY_00001
Type
PANJIT
Minimum package
1250 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
UF3010GP_AY_00001
Electronic Component
1
Package
DO-201AD
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
1.16g
Electronic Component
1
Electronic Component
BM0264894082
Current
3A
Diode
1
Current(Ir)
1uA
(Vf)
1.7V@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
1250

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UF3010GP_AY_00001 产品概述

一、产品简介

UF3010GP_AY_00001 是强茂(PANJIT)出品的一款超快恢复二极管(Ultra Fast Recovery Diode),采用 DO-201AD 轴向封装,专为高压、高速开关整流应用设计。该器件在3A整流电流下正向压降典型为1.7V,反向耐压高达1000V,反向恢复时间仅75ns,兼顾高压耐受与低开关损耗,适用于对效率与开关特性有较高要求的电源系统。

二、主要特点

  • 高反向耐压:Vr = 1kV,可用于高压整流与保护电路。
  • 中等功率整流能力:整流电流 If(AV) = 3A,适合中功率级别应用。
  • 低正向压降:Vf = 1.7V @ 3A,有利于降低导通损耗。
  • 极小反向电流:Ir ≈ 1µA(典型,随温度上升会增大)。
  • 超快恢复:Trr = 75ns,减小反向恢复引起的开关损耗与EMI。
  • 抗浪涌能力:非重复峰值浪涌电流 Ifsm = 150A,适用于短时冲击电流场景。
  • 宽工作结温:Tj = -55℃ ~ +150℃,可靠性好,适应恶劣环境。

三、典型应用场景

  • 开关电源(SMPS)中的高压整流或输出整流;
  • 功率因数校正(PFC)电路;
  • 逆变器与电机驱动中的自由轮或反并联整流;
  • 高压充电器、HV DC-DC 变换器与电源模块;
  • 需要快速恢复特性的脉冲整流或保护电路。

四、关键参数与设计要点

  • 反向恢复时间(Trr)75ns:在高频开关下可显著降低开关损耗,但需要注意与驱动、布局匹配以免产生振铃。
  • 正向压降与功耗:Vf 1.7V@3A 对应的导通损耗为约5.1W(短时间),在实际设计中需考虑散热与平均功率分担,必要时采用散热片或良好通风。
  • 反向电流与温度:Ir 在高温下会上升,长期高温工作应适当降额使用或增加散热以维持可靠性。
  • 浪涌能力 Ifsm 150A:能承受短时冲击电流,但不宜作为长期过载使用,且要评估电路中的电感与整流浪涌路径。

五、使用建议与注意事项

  • 在高频开关应用中,注意走线短且阻抗可控,放置适当的RC缓冲或斜率控制以抑制尖峰和振铃。
  • 对于长期工作在高电流或高散热条件下,应合理设计散热结构,保证结温不超过规格上限。
  • 选择时确认测试条件(如Ir 测试电压与温度)与实际工况一致,必要时参考完整Datasheet的曲线图。
  • 封装为 DO-201AD,适合手工或机加工轴向焊接,注意焊接温度与热冲击对器件可靠性的影响。

六、封装与采购

  • 品牌:PANJIT(强茂)
  • 封装:DO-201AD(轴向)
  • 型号:UF3010GP_AY_00001
    建议在选型与采购前下载并仔细阅读厂商 Datasheet,确认所有极限值、热阻及波形测试条件,以确保在目标应用中获得预期性能与可靠度。若需替代件或热仿真建议,可提供电路工况以便进一步匹配与计算。

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