WMSIC Electronic Components

PANJIT RB751S40-AU_R1_000A1 RB751S40

ModelRB751S40-AU_R1_000A1
PackageSOD-523
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT RB751S40-AU_R1_000A1
Type
PANJIT
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
RB751S40-AU_R1_000A1
Electronic Component
1
Package
SOD-523
Electronic Component
Schottky Diode
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0264241003
Current
300mA
Diode
1
Current(Ir)
1uA@40V
(Vf)
370mV@1mA
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB751S40-AU_R1_000A1 产品概述

一、产品简介

RB751S40-AU_R1_000A1 是强茂(PANJIT)推出的一款小型肖特基整流二极管,额定反向电压40V,直流整流电流0.3A,封装为SOD-523。该器件以低正向压降和快速恢复特性为主要卖点,适合便携式电源、开关电源的高速整流和电路反向保护场合。

二、主要电气参数

  • 正向压降 Vf:370mV @ 1mA(低电流条件下表现优异,低功耗)
  • 直流反向耐压 Vr:40V
  • 额定整流电流 If(AV):300mA
  • 反向电流 Ir:1μA @ 40V(常温)
  • 非重复峰值浪涌电流 Ifsm:500mA(一次性峰值冲击能力)
  • 工作结温范围:-55℃ 至 +125℃

三、关键特性与优势

  • 低正向压降:在低电流条件下损耗小,有利于延长电池寿命和降低热耗。
  • 低反向漏电:在高阻态下漏电流小,适合需要低静态功耗的应用。
  • 小型封装:SOD-523 适合高密度贴片布局,节省PCB空间,适用自动贴装与回流焊工艺。
  • 宽温度范围与良好浪涌能力:适应汽车电子和工业等宽温场景(需按应用做散热设计)。

四、封装与热管理

SOD-523 为超小型表贴封装,热阻较高,器件散热主要依赖PCB铜箔和底层散热路径。连续工作电流接近额定值时应注意在PCB上提供足够铜箔面积或热沉,避免长期高温导致反向漏电和可靠性下降。

五、典型应用

  • 便携式设备的整流与电源反向保护
  • 开关电源输出整流与取样回路
  • 快速切换器件的保护二极管、功率路径控制
  • 低压差稳压器的输出整流及防反接电路

六、设计注意事项与可靠性

  • 正向压降在高电流时会显著上升,实际电压降应参考完整的I–V曲线并做热耦合评估。
  • 非重复峰值浪涌电流为短时能承受能力,不可作为反复冲击条件下的连续规范。
  • 反向漏电随温度上升增大,需在高温工况下按最坏情况进行裕量设计。
  • 建议遵循厂商的回流焊温度曲线与管脚湿度控制要求,以保证长期可靠性。

总结:RB751S40-AU_R1_000A1 在低压、低损耗、空间受限的整流与保护场景中具有明显优势,适用于对功耗和尺寸有严格要求的现代电子系统中。若需进一步电参数曲线或封装尺寸图,请参阅厂商详细数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.