Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT GS1G_R1_00001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT GS1G_R1_00001
- Type
- PANJIT
- Minimum package
- 1800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- GS1G_R1_00001
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.089g
- Electronic Component
- 1
- Electronic Component
- BM0257698734
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 1uA@400V
- (Vf)
- 1.1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 1800
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GS1G_R1_00001 — PANJIT 强茂 通用整流二极管 产品概述
一、产品简介
GS1G_R1_00001 为 PANJIT（强茂）出品的通用整流二极管，独立式（SMA / DO-214AC 封装），额定整流电流 1A，直流反向耐压 400V，正向压降 1.1V（@1A）。该器件设计用于各类开关电源、整流与保护电路，兼顾耐压、低正向压降与抗浪涌能力，适合工业与消费类电子的通用整流需求。
二、主要电气参数
- 正向压降 (Vf)：1.1V @ 1A
- 直流反向耐压 (Vr)：400V
- 额定整流电流：1A（Dc）
- 反向漏电流 (Ir)：1µA @ 400V
- 非重复峰值浪涌电流 (Ifsm)：35A（单次脉冲）
- 工作结温范围：-55℃ ~ +150℃
三、结构与封装特点
- 封装：SMA (DO-214AC)，为表面贴装型封装，体积小、便于自动化贴装与回流焊工艺。
- 热性能：SMA 封装体积有限，连续大电流工作时需结合 PCB 铜箔散热设计，扩展散热区域可降低结温。
- 机械可靠性适合工业级环境，允许较宽温度范围运行。
四、典型应用场景
- 开关电源与整流模块的二极管整流单元
- 直流母线或功率转换设备中的反向保护、极性保护
- 输入浪涌或突波保护（考虑非重复峰值浪涌承受能力）
- 通用小功率适配器、家电控制板、仪器仪表电源等
五、设计选型与使用建议
- 若对效率/发热有更高要求，可考虑低 Vf 的肖特基二极管；若需更高耐压则考虑 600V 以上等级器件。
- 在连续 1A 工作条件下，建议在 PCB 上配置充足铜箔与散热走线，并避免在高环境温度下长期满载运行；关注结温并留有余量。
- 非重复峰值浪涌 35A 能承受启动或冲击脉冲，但频繁冲击会降低寿命，应在电路上配合限流或浪涌抑制器。
- 对于高阻抗敏感电路，低反向漏电（1µA @400V）有助于维持系统可靠性与低静态功耗。
六、可靠性与质量关注
PANJIT（强茂）作为知名半导体品牌，GS1G_R1_00001 适配工业级使用条件，工作结温覆盖 -55℃ 到 +150℃。在批量应用前建议进行实际环境下的热仿真与寿命验证，以确保满足目标产品的长期可靠性需求。
如需器件封装尺寸、管脚图、特性曲线或样片支持，可提供更详细的数据手册以便电路仿真与实际封装设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
