Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT 1SMA5929_R1_00001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT 1SMA5929_R1_00001
- Type
- PANJIT
- Minimum package
- 1800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- 1SMA5929_R1_00001
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Zener Diode
- Electronic Component
- 0.088g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 9Ω
- Electronic Component
- BM0257662888
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 1.5W
- Electronic Component
- 14.25V~15.75V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMA5929_R1_00001 产品概述
一、产品简介
1SMA5929_R1_00001 为 PANJIT（强茂）出品的独立式稳压二极管（Zener），标称稳压值 15V，实际稳压范围 14.25V ～ 15.75V，封装为 SMA（DO-214AC）。该器件适用于低功耗稳压、基准源、过压/钳位保护及电路偏置电路，凭借小体积与良好的热特性，可方便地贴装于 PCB 用于局部稳压或钳位保护场合。
二、主要电气参数
- 稳压值（标称）：15V；范围：14.25V ～ 15.75V
- 反向电流 Ir：1 μA @ 11.4V（在该反向电压下的漏电流）
- 耗散功率 Pd：1.5W（在适当散热条件下）
- 动态阻抗 Zzt：9 Ω（在测试电流下的动态阻抗）
- 曲膝处阻抗 Zzk：600 Ω（在低电流或转折区域的阻抗特性）
- 结温范围：-55 ℃ ～ +150 ℃
三、主要特性与优势
- 小型 SMA 封装，适合自动贴装，节省 PCB 面积。
- 稳压精度较好，14.25V～15.75V 区间满足多数 15V 应用要求。
- 低反向漏电流，适用于高阻抗或微功耗偏置电路。
- 合理的耗散功率（1.5W）配合良好 PCB 散热可实现稳定工作。
四、封装与引脚
封装：SMA（DO-214AC），单独二极管结构，两个引脚分别为阳极和阴极。推荐按厂商数据手册使用推荐焊盘尺寸与过孔铜厚，以保证散热与可靠焊接。
五、应用场景
- 稳压参考与局部电源稳压（低至中等功率）。
- 电路保护与钳位（防止电压超限损坏敏感器件）。
- 信号偏置与基准电压源。
- 工业控制、家电与通信终端的稳压、保护模块。
六、使用建议与注意事项
- 工作时注意总耗散功率不要超过 1.5W，并考虑 PCB 铜层作为散热路径；高环境温度下需降额使用。
- 在电路设计中留意稳压点对应的测试电流范围，避免在曲膝区长期工作导致大幅稳压漂移。
- 推荐在输入侧加入限流元件（电阻或恒流源）以保护稳压二极管并控制功耗。
- 储存与焊接过程应遵循湿敏等级与回流焊规范，防止封装受潮或热损伤。
- 出货前请参考 PANJIT 官方完整数据手册以获取详细的电气特性曲线和 PCB 推荐布局。
若需更详细的电气特性曲线、热阻参数或等效电路模型，可提供将为您检索并整理完整数据表。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
