Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PANJIT P6SMB6.8A_R1_00001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT P6SMB6.8A_R1_00001
- Type
- PANJIT
- Minimum package
- 800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- P6SMB6.8A_R1_00001
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.108g
- Electronic Component
- 1
- Electronic Component
- BM0227686026
- Operating Temperature
- 55℃~+150℃
- Voltage
- 19.5V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 1mA
- Voltage(VBR)
- 7.14V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
P6SMB6.8A_R1_00001 产品概述
一、产品简介
P6SMB6.8A_R1_00001 为 PANJIT（强茂）推出的一款单向瞬态电压抑制二极管（TVS），采用 SMB（DO-214AA）封装，专为抑制瞬态过电压和静电放电（ESD）而设计。器件在 10/1000 μs 浪涌条件下，具有高峰值脉冲能量吸收能力，适用于工业、通信、电源及车载等对浪涌与静电防护有严格要求的场合。
二、主要电气参数
- 极性：单向
- 反向额定工作电压（Vrwm）：5.8 V
- 击穿电压（Vbr）：7.14 V
- 钳位电压（Vclamp）：19.5 V（指定脉冲条件下）
- 峰值脉冲电流（Ipp）：57 A @ 10/1000 μs
- 峰值脉冲功率（Ppp）：600 W @ 10/1000 μs
- 反向漏电流（Ir）：约 1 mA（在 Vrwm 条件下典型）
- 工作温度范围：-55 ℃ ~ +150 ℃
- 防护等级：符合 IEC 61000-4-2（ESD 抗扰标准）
三、产品特性与优势
- 高能量吸收：在 10/1000 μs 浪涌下能承受高达 600 W 的脉冲功率，适合雷击及浪涌保护场景。
- 快速响应：TVS 器件响应速度快，可在瞬时电压上升时迅速钳位，保护后端敏感元件。
- 宽温度范围：-55 ℃ 至 +150 ℃，适应恶劣环境与工业级应用。
- SMB 小体积封装：便于线路板安装与自动贴片生产，兼顾散热和占板面积。
四、典型应用场景
- 电源输入端浪涌保护（DC 电源线、适配器入口）
- 通信接口、信号线过压与 ESD 防护
- 工业控制设备与仪表的浪涌防护
- 车载电子低压线路（需按车规额外验证）
五、设计与使用建议
- 布局：将 TVS 器件尽量靠近受保护端口或电源入口，最短导线以降低感性过电压。
- 热设计：大能量冲击会产生大量热量，建议在 PCB 设计中增加铜箔面积以利散热，并配合熔断器或限流电阻实现级联保护。
- 选型留量：选用 Vrwm 与工作电压应有适当裕度，钳位电压需低于被保护电路的最高承受电压。
- 焊接：遵循器件制造商提供的焊接及回流曲线，避免过高温度或长时间加热导致器件性能退化。
六、可靠性与合规
P6SMB6.8A_R1_00001 针对 IEC 61000-4-2 ESD 等级进行了设计与验证，能够抵御常见的静电冲击。对于特定行业（如车规、医疗），在最终设计中建议进行系统级的浪涌与温度循环验证以满足最终认证要求。
如需更详细的数据表、典型波形与封装尺寸（SMB/ DO-214AA）或大批量采购信息，可联系厂商或授权分销渠道获取完整技术资料与样品。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
