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PANJIT RS1K_R1_00101
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT RS1K_R1_00101
- Type
- PANJIT
- Minimum package
- 1800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- RS1K_R1_00101
- Electronic Component
- 1
- Package
- DO-214AC
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.097g
- Electronic Component
- 1
- Electronic Component
- BM0263665353
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 1uA@800V
- (Vf)
- 1.3V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 1800
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RS1K_R1_00101 产品概述
一、产品简介
RS1K_R1_00101 是由 PANJIT（强茂）推出的一款高压快速恢复整流二极管，采用表面贴装 DO-214AC 封装，针对需要节省电路板空间且要求较高开关效率的电源与整流应用而设计。器件具有玻璃钝化结、抗潮耐热的绿色模塑外壳，并通过无铅与阻燃材料工艺，适合现代电子制造的可靠性与环保要求。
二、主要参数
- 二极管数量：1 个独立式
- 正向压降（Vf）：1.3 V @ 1 A
- 直流反向耐压（Vr）：800 V
- 额定整流电流：1 A
- 反向电流（Ir）：1 μA @ 800 V
- 反向恢复时间（Trr）：500 ns
- 工作结温范围：-55 ℃ ~ +150 ℃
- 封装：DO-214AC（适用于表面贴装工艺）
- 品牌：PANJIT（强茂）
三、主要特性
- 小型表面贴装封装，易于自动化拾取与贴装，节约印制板空间并提高产线效率。
- 快速恢复时间（Trr ≈ 500 ns），适合开关频率较高的电源转换场合，有助于降低开关损耗与电磁干扰。
- 低反向漏电流（1 μA @ 800 V），在高压条件下能保持较低功耗与稳定的漏电特性。
- 塑料模塑外壳达到 UL 94V-0 阻燃等级；采用玻璃钝化结，提高结面稳定性与长期可靠性。
- 无铅产品，符合欧盟 RoHS 2.0 要求；模塑料符合 IEC 61249 的绿色材料规范。
四、典型应用
- 开关电源（SMPS）次级整流与高压整流
- 功率因数校正（PFC）电路中的高压整流/回收路径
- 电机驱动、逆变器及照明驱动（LED 驱动器）中的快速恢复整流
- 作为自由奔放（二极管钳位）、防反接及浪涌抑制元件
五、设计与使用建议
- 布局与散热：尽量缩短关键回路的走线，增设焊盘散热铜箔并在必要处使用过孔导热，以改善结温上升。尽管额定整流电流为 1 A，但在高结温或高频工作下应进行适度降额设计。
- 焊接工艺：适配常见的回流焊工艺，注意遵循元器件厂商推荐的回流温度曲线与峰值温度，以保证封装与内部焊接质量。
- 抗干扰：在高频开关电路中，配合适当的缓冲电路或 RC 抑制网络，减少开关过程中的振铃与过压应力，从而延长器件寿命。
- 储存与环境：避免长时间在高湿环境中储存，使用防潮包装并按厂家建议回潮处理后再进行焊接。
六、包装与合规
RS1K_R1_00101 提供适用于自动化装配的托盘或卷带包装，器件材料符合 RoHS 2.0 无铅要求，模塑材料满足 UL 94V-0 阻燃等级与 IEC 61249 绿色材料规范，适合要求环保与可靠性的量产项目。
总结：RS1K_R1_00101 以其 800 V 高耐压、快速恢复与表面贴装封装的组合，适合高压开关电源与整流场景，需要在设计中关注散热与开关应力管理，以发挥其高效率与长期可靠性的优势。
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