WMSIC Electronic Components

PANJIT 1SMA5934_R1_00001

Model1SMA5934_R1_00001
PackageSMA
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT 1SMA5934_R1_00001
Type
PANJIT
Minimum package
1800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
1SMA5934_R1_00001
Electronic Component
1
Package
SMA
Electronic Component
Zener Diode
Electronic Component
0.118g
Electronic Component
1
(Zzk)
700Ω
(Zzt)
19Ω
Electronic Component
BM0264356033
Diode
1
Power Dissipation(Pd)
1.5W
Electronic Component
22.8V~25.2V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA5934_R1_00001 产品概述

本产品为 PANJIT(强茂)出品的稳压二极管 1SMA5934_R1_00001,采用 SMA 封装,标称稳压值 24V,额定耗散功率 1.5W(1500mW)。该器件为独立式 Zener 稳压二极管,适用于对电压基准与过压钳位有中低功耗要求的电子电路。其结构和参数设计兼顾了体积、散热以及工业级工作温度范围,适合在消费电子、工业控制和电源管理等多种场景中应用。

一、主要电气参数概览

  • 稳压值(标称):24V
  • 稳压值允许范围:22.8V ~ 25.2V
  • 反向电流(Ir):1 μA @ 18.2V
  • 最大耗散功率(Pd):1.5W
  • 动态阻抗(Zzt):19 Ω(测试点对应条件下的动态阻抗)
  • 膝部阻抗(Zzk):700 Ω(用于低电流区的特性描述)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SMA(独立式封装,便于贴装和更换)
  • 型号描述:稳压二极管 1500mW, ZENER, SMA, 24V

二、特点与优势

  • 稳定的输出电压:24V 标称值及 22.8–25.2V 的允许范围,适合用于作为电压参考或简单稳压源。
  • 低反向漏电:在 18.2V 时反向电流仅 1 μA,有利于在待机或低功耗场景中维持较低漏电损耗。
  • 较低的动态阻抗:Zzt=19Ω 表明在规定测试电流附近具有较好的稳压能力,减少因电流波动带来的电压漂移。
  • 宽工作温度:-55 ℃ 到 +150 ℃,适配严苛环境与工业级应用。
  • SMA 封装:体积小、成本低、易于贴装与焊接,适合中等功率板级应用。

三、典型应用场景

  • 参考电压源:作为 24V 参考电压或对电压轨做本地稳压、偏置保护。
  • 电源钳位与过压保护:保护后续电路不被瞬态过电压损坏。
  • 放大器与传感器偏置:提供稳定偏置点以保证放大器或传感器工作点稳定。
  • 通信与工业设备:对电源线路进行分压/钳位,特别适用于要求中等功率且空间受限的场合。
  • 测试与实验平台:方便用于试验电路中作简单稳压或保护元件。

四、使用与设计注意事项

  • 功率与降额:标称 Pd=1.5W 为典型最大耗散值,实际允许功耗会随环境温度和 PCB 散热条件下降额。推荐在高环境温下提供足够铜箔散热或将允许耗散打折使用,以保证结温不超过最大工作温度。
  • 热管理建议:SMA 为表面贴装小封装,热阻相对较高。可通过扩大焊盘铜面积、在器件下方及周围提供散热铜箔或使用多层接地/电源平面改善散热。
  • 焊接与可靠性:遵循制造商的回流焊温度曲线与建议焊盘设计,避免过热造成器件性能退化。对重复温度循环和机械应力敏感的场合,应进行可靠性评估。
  • 工作电流选择:Zener 的稳压与动态阻抗与工作电流密切相关。应根据负载与所需稳压精度选择合适的串联限流元件,以使二极管工作在合适的测试或稳定区间。
  • 测试与验证:在设计定型前,建议进行温升、功耗、动态响应(如瞬态抑制能力)以及在实际负载下的稳压性能验证。

五、典型参数解读(便于设计参考)

  • 反向电流 Ir=1 μ[email protected]:表明在较低电压时漏电小,有利于低功耗场景。
  • Zzt=19 Ω:在中电流区动态阻抗较低,稳压效果好;需结合厂方曲线和测试电流确认具体工作点表现。
  • Zzk=700 Ω:膝部阻抗较高,表示在接近阈值的低电流区稳压特性开始转变,应避免长期以极低电流工作以免稳压不佳。

六、采购与资料

1SMA5934_R1_00001 由 PANJIT(强茂)生产,封装为 SMA。为获得详细的电气特性曲线(例如 I-V 曲线、温度依赖曲线、功率降额曲线、封装热阻等)及最新的可靠性与合规性信息,请以强茂官方数据手册为准或联系厂商/经销商获取样片与完整规格书。

如需进一步按具体电路条件(环境温度、负载电流、PCB 布局等)进行热计算或选型建议,可以提供电路示意与工作工况,我可协助做更具体的计算与布局建议。

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